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Description
Supports ultra-micro hole drilling, lift-off, etching, scribing, dicing, and material removal on a wide range of substrates.
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Material Compatibility
Alumina, zirconia, silicon wafers, sapphire, glass, metals, polymers, carbon fiber, PET, PI, and composite materials.
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Key Advantages
- Non-damaging micropores with minimal thermal impact
- High-speed processing with stable accuracy
- Contactless machining prevents micro-cracks and edge chipping
- CCD vision positioning for automated alignment
- Integrated dust removal ensures clean working surfaces
Introduction of Equipment
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Core Functions
- Independently developed control software supporting direct CAD import
- CCD automatic positioning with real-time galvanometer and linear motor adjustment
- Electric lifting worktable and vacuum adsorption tray for stable material handling
- Unique dust removal system ensures clean processing of glass and ceramics
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Main Components
Laser, optical path system, linear motor worktable, control system, positioning system, dust extraction, air blowing, vacuum adsorption
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Power Options
5W / 10W / 15W / 20W / 30W, suitable for different thicknesses and applications:
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Power |
Application |
Suitable material thickness |
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1w-3w |
Fine marking (QR code, logo), thin film perforation (<0.2mm) |
Ultra-thin glass, PI film, thin alumina (<0.3mm) |
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5w-8w |
Micro-pore cutting of ceramic mid-frame for mobile phones, FPC cover film cutting, silicon wafer scribing |
Alumina 0.3–1.0 mm, glass 0.4–0.7 mm |
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10w-15w |
Drilling thick ceramic (1–2mm), cutting sapphire crystal covers, drilling multi-layer PCBs |
Alumina/zirconia 1–2mm, sapphire 0.5–1mm |
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20w-30w |
High-speed batch drilling and thick substrate cutting (requires high repetition frequency). |
Alumina ≤3mm (parameters need optimization) |
Technical Data
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Item |
Parameter |
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Laser wavelength |
355nm UV laser |
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Laser output power |
10-15W(optional) |
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Machining area (maximum) |
400*400mm |
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Single cutting area: |
50*50mm |
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Z-axis travel |
50mm |
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Minimum focused spot |
10µm |
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Table positioning accuracy |
±3µm |
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Worktable repeatability |
±2µm |
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CCD vision positioning accuracy |
±3µm |
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Scanning speed |
Max:4000mm/s |
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Equipment dimensions |
1400mm (L) × 1500mm (W) × 1800mm (H) Maximum processing size 400*400mm, weight approximately 1500KG |
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Adsorption system |
Fan airflow 100m³/h |
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Chiller |
Water chiller temperature control range 18℃~24℃, temperature control accuracy ≤0.2℃ |
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Power consumption |
3000W |
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Software system |
Features galvanometer scanning and platform movement linkage functions; Features functions for controlling laser processing parameters; Meets CAD file import requirements, supports importing and processing drawings larger than 1GB |
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Processable file formats |
Standard DXF files. |
OEM & Customization Options
- Adjustable laser power and machining area to meet different material and thickness requirements
- Software parameter tuning for specific ceramic, glass, or composite materials
- Tailored solutions for high-precision micro-hole arrays and multi-pattern processing
Quality Control
- Real-time process monitoring and defect detection for high yield
- Dust removal and cleaning for micro-particle control
- Full-process traceability for high-end electronics and aerospace standards
After-Sales Service
- Installation & commissioning: on-site or remote support
- Operator training: professional guidance for operation and maintenance
- Technical support: troubleshooting and process optimization
- Spare parts & maintenance: long-term availability.
Key Applications
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Industry |
Application |
Typical Processes |
Advantages |
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Consumer Electronics |
Ceramic mid-frame/back panel, FPC |
Micro-pore cutting, scribing, etching |
Non-damaging, high precision, 5G/WiFi compatible |
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Semiconductor |
Silicon wafers, multi-layer PCBs |
Through-hole/etching |
High verticality, smooth walls, minimal thermal impact |
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Medical Electronics |
Microfluidic chips, implantable devices |
Drilling, marking |
Biocompatible, precision holes |
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Aerospace |
Ceramic substrates, high-density interconnects |
Drilling, cutting |
High yield, multi-layer alignment |
Our Commitment
We offer more than equipment - we deliver a productivity engine focused on precision, reliability, and efficiency. The Alumina Ceramics UV Laser Drilling Machine embodies the pursuit of perfection and ensures superior quality for your products.
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