Product Description

This equipment utilizes a picosecond infrared laser (1064nm), suitable for high-speed laser etching, stripping, etching, scribing, dicing, material removal, and fabrication on various material surfaces. It can also perform micro-machining such as scribing and grooving on the surfaces of silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the requirements for cutting and drilling ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.).

Equipment Introduction

The infrared picosecond laser cutting machine mainly consists of: a laser, an optical path system, a linear motor worktable, a control system, a positioning system, a dust extraction system, an air blowing system, and a vacuum adsorption system.

The equipment is equipped with independently developed control software, supporting direct import of CAD data, and features a CCD automatic positioning system for precise laser etching. Operation is simple, efficient, and fast. It supports real-time software adjustment of the galvanometer and linear motor, and the electric lifting worktable design, along with the vacuum adsorption tray device, effectively solves the problem of material stability during processing. Its unique dust removal system design ensures the cleanliness of the glass and the working surface.

Advantages

This laser cutting machine integrates advanced opto-mechanical technologies such as CNC technology, laser technology, and software technology, featuring high flexibility, high precision, and high speed. It can perform precise, high-speed etching of various patterns and sizes over a wide range, while ensuring high production capacity. It is a reliable, stable product with a high performance-price ratio.

Technical data

Item	Parameter
Laser	1064nm 70W picosecond infrared laser
Laser Pulse Width	＜30ps
Processing Area	300x300mm
Single Cutting Area	50x50mm
Minimum Focused Spot	10μm
Minimum Aperture Width	25μm
Laser Frequency Range	100Hz-2000kHz
Minimum Etching Line Width	10µm (ITO conductive glass)
Minimum Line Spacing	15μm
Table positioning accuracy	±2µm
Straightness	±5μm
Table repeatability	±2µm
Z-axis travel	50mm
CCD auto-positioning accuracy	±2µm
Scanning speed	Maximum speed 5000mm/s
Equipment dimensions	1400mmL×1500mmW×1800mmH
Adsorption system	Fan airflow 100m³/h
Chiller	The water chiller has a temperature control range of 18℃~24℃ and a temperature control accuracy of ≤0.2℃.
Power consumption	3000W
Software system	It features galvanometer scanning and platform movement linkage; it also has functions for controlling laser processing parameters; and it meets CAD file import requirements, accommodating drawings larger than 1GB for processing.
Equipment casing	The equipment is fully enclosed and has an internal door switch to prevent the laser from posing a danger to people.
Processable file formats	Standard DXF file