Your Professional silicon nitride （ Si₃N₄ ）Ceramic Laser Cutting Machine Supplier！
YCLaser develops and manufactures laser processing machines for silicon nitride (Si₃N₄) ceramics, covering thin ceramic substrates, power module components, structural ceramics, and thicker Si₃N₄ parts.
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About Our Si₃N₄ Laser Cutting Machines
|
No. |
Item |
Parameter |
|
1 |
Laser Wavelength |
1060–1080 nm |
|
2 |
Laser Output Power |
150–1000 W (optional) |
|
3 |
Max. Cutting Area |
≤ 300 × 400 mm (customize) |
|
4 |
Cutting Thickness |
0.2–10 mm (material-dependent) |
|
5 |
X/Y Axis Repeat Positioning Accuracy |
± 5 μm |
|
6 |
Processing Speed |
0–2000 mm/min |
|
7 |
Max. Travel Speed |
50 m/min |
|
8 |
Processing Accuracy |
± 0.01–0.02 mm |
|
9 |
Worktable Accuracy |
≤ 0.015 mm |
|
10 |
Transmission |
Linear motor + 0.5 μm grating scale |
|
11 |
Total Machine Power (excluding fan) |
≤ 5 kW |
|
12 |
Total Machine Weight |
approx. 1200 kg |
|
13 |
Overall Dimensions (L × W × H) |
1150 × 1500 × 1850 mm (subject to actual product) |
*The specific equipment is subject to the actual product.
Key Advantages
Material-Specific Process Development
Laser parameters and scanning strategies tailored to Si₃N₄ material, thickness, geometry, and quality requirements.
High-Power Processing for Thick Ceramics
QCW fiber lasers deliver high pulse energy for demanding ceramic cutting, including thick silicon nitride components.
Non-Contact Machining
Non-contact processing eliminates tool wear and mechanical stress on the workpiece.
Flexible Processing Functions
Configurable for cutting, drilling, scribing, grooving, and complex contour machining.
Vision-Based Positioning
Integrated CCD vision for accurate workpiece alignment and feature recognition.
Customized Machine Configuration
Working area, laser power, motion system, automation, dust extraction, and processing functions fully customizable.
Si₃N₄ Laser Processing Capabilities
|
Laser Process |
Typical Application |
|
Contour Cutting |
Complex Si₃N₄ component profiles |
|
Precision Cutting |
Thin ceramic substrates and precision parts |
|
Grooving / Slotting |
Power modules and structural components |
|
Laser Scribing |
Controlled ceramic separation and surface processing |
|
Through-Hole Drilling |
Mounting, positioning and functional holes |
|
Blind-Hole Drilling |
Functional ceramic components |
|
Cooling-Hole Drilling |
Thermal management components |
|
Micro-Hole Processing |
Precision ceramic applications |
Typical Si₃N₄ Laser Cutting Samples
Our Si₃N₄ sample-processing portfolio covers different material thicknesses, component geometries, and laser-processing requirements.
Typical Sample 01 — Si₃N₄ Structural Ceramic
Complex-profile cutting for structural and functional ceramic components.
Typical Sample 02 — Thick Si₃N₄ Ceramic
High-power laser processing of thicker silicon nitride components.
Typical Sample 03 — Si₃N₄ Precision Holes
Laser drilling for through holes, mounting holes, positioning holes, and other functional openings.
Typical Sample 04 — Si₃N₄ Complex Contour
Non-contact laser cutting for customized ceramic geometries.
Processing results depend on the actual Si₃N₄ material, thickness, geometry, and selected laser parameters.
Why Choose YCLaser?
Advanced Ceramic Laser Processing Expertise
WHYC Laser focuses on laser processing equipment for advanced ceramics and other difficult-to-machine materials, including Al₂O₃, AlN, Si₃N₄, SiC, ZrO₂, and related ceramic components.
01
Customized Equipment Development
We do not limit Si₃N₄ applications to one standard machine. Laser power, processing area, motion system, vision positioning, automation, and auxiliary systems can be configured according to the customer's application.
02
Process Development Before Equipment Investment
For new or demanding applications, our engineering team can conduct sample testing to evaluate processing feasibility and develop suitable laser parameters.
03
Integrated Manufacturing Capability
From laser-system selection and process development to machine design, assembly, testing, and technical support, we provide an integrated equipment solution.
04
Application-Oriented Support
Our goal is not simply to supply a laser source or machine platform. The final system is developed around the customer's material, part geometry, quality requirements, and production target.
05
Our Service
YClaser adheres to a customer-centric approach, providing your company with comprehensive pre-sales and after-sales services, including installation, commissioning, training, and maintenance.
Pre-Sales Service
Prior to signing the contract, YClaser provides customers with comprehensive support including production process solutions, technical consultation on laser equipment, sample testing, equipment selection guidance, as well as professional advice on technical parameters and pricing.
Customer Visit
We sincerely welcome customers to visit our company at any time. Our dedicated reception team will provide thoughtful reception services, including catering and transportation arrangements, to ensure a comfortable and convenient visiting experience.
In-Sales Service
In accordance with the contract, YClaser ensures safe delivery of equipment to the customer's designated location within the agreed time. Our technical engineers will provide on-site installation and commissioning, which will be completed within one week once basic conditions are met, maintaining a clean and orderly work site.
- We offer free professional training for at least 3 days after installation, covering:
- Equipment startup/shutdown procedures
- Cutting control software operation
- Daily equipment maintenance
After-Sales
YClaser offers a one-year free warranty for the whole machine, lifetime maintenance, and free replacement of damaged parts caused by non-human factors during the warranty period.
Our customer service responds within 12 hours. We will first provide remote video support; if the issue cannot be resolved remotely, our technicians will be dispatched for on-site service.
After the warranty period, we continue to provide complete hardware and software support, as well as lifetime free system upgrades.
What Should You Send Us?
To make the evaluation more effective, please provide:
- Material: Si₃N₄ grade or material specification
- Thickness: Ceramic thickness
- Part Size: Maximum workpiece dimensions
- Drawing: DXF, DWG, PDF, or other available format
- Process: Cutting / drilling / scribing / grooving
- Quality: Dimensional tolerance and edge-quality requirements
- Production: Estimated daily or monthly production volume
FAQ
Q: What thickness of silicon nitride can a laser cutting machine process?
A: The processable thickness depends on the Si₃N₄ material, geometry, laser configuration, and required edge quality. Representative WHYC Laser configurations can cover approximately 0.2–11 mm for selected silicon nitride applications. Sample testing is recommended for final process verification.
Q: What laser is suitable for cutting silicon nitride?
A: For many Si₃N₄ cutting applications, 1060–1080 nm QCW fiber laser systems can be used. However, laser power and processing parameters should be selected according to material thickness, geometry, and quality requirements. Thin and high-precision applications may require a different laser configuration.
Q: Can the machine process Si₃N₄ AMB substrates?
A: Yes. Dedicated configurations are available for silicon nitride power-module and AMB substrate applications. Depending on the substrate structure and requirements, the system can be configured for contour cutting, slotting, scribing, drilling, and related processes.
Q: Can silicon nitride be laser drilled?
A: Yes. Laser drilling can be used for different Si₃N₄ hole-processing applications, including through holes, blind holes, positioning holes, mounting holes, cooling holes, and airflow holes. The appropriate drilling method depends on hole diameter, depth, material thickness, and required hole quality.
Q: Can you test our silicon nitride samples before we buy the machine?
A: Yes. WHYC Laser provides sample testing and process evaluation. Customers can provide Si₃N₄ samples, drawings, material specifications, and target processing requirements for evaluation.
Q: Can the Si₃N₄ laser cutting machine be customized?
A: Yes. Machine configuration can be customized according to working area, material thickness, laser power, processing method, positioning requirements, automation level, and production volume.
We are one of the most professional si₃n₄ laser cutting machine manufacturers and suppliers in China, also support customized service. Be free to buy industrial si₃n₄ laser cutting machine for sale here and get quotation from our factory. For price consultation, contact us.
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