A: The suitable laser source depends on the ceramic material, thickness, geometry, hole size, edge-quality requirements and production volume. For example, UV lasers are generally better suited to thin ceramics, micro-holes and fine structures, while QCW fiber lasers are more suitable for thicker ceramics, larger contours and higher-throughput processing. Sample testing is recommended before final equipment selection.

A: Our ceramic laser systems can be configured for a wide range of advanced ceramics, including Al₂O₃ (alumina), AlN (aluminum nitride), Si₃N₄ (silicon nitride), ZrO₂ (zirconia), SiC (silicon carbide), LTCC, HTCC, DBC, DPC and other hard, brittle ceramic materials. The laser configuration and process parameters are selected according to the specific material and application.

A: Cutting thickness varies by ceramic material and laser setup. Our solutions support applications from thin ceramic substrates to thick structural ceramics.
For reference: UV lasers process zirconia at 0.1–0.8 mm. QCW lasers handle 1–20 mm, with proven cases on 20 mm silicon nitride and 13 mm alumina. 
Standard thicknesses (2–6 mm) are readily achievable. Send your samples for testing to verify processing performance.

A: Yes. Ceramic laser systems can be configured for micro-hole drilling, narrow slots, positioning holes, through holes, blind holes and complex contours. In selected ceramic applications, hole diameters as small as approximately 0.05 mm (50 μm) are achievable, depending on material, thickness and hole geometry.

A: Yes. We provide sample testing and process evaluation before equipment purchase. You can send us your ceramic samples, drawings or CAD files together with material thickness, hole diameter, cutting dimensions and required edge quality. Our engineering team can then evaluate the process and recommend a suitable laser source, power configuration and machine setup.

A: Yes. Machine configurations can be customized according to your processing area, laser power, workpiece size, production volume and automation requirements. Options can include dual-head processing, CCD vision positioning, automatic loading and unloading, customized fixtures and other automation functions.

A: To recommend a suitable solution, we normally need:
 

* Ceramic material and grade
* Material thickness
* Workpiece dimensions
* Cutting or drilling pattern
* Minimum hole diameter or slot width
* Required dimensional tolerance and edge quality
* Expected production volume
* CAD drawings or samples
 

This information allows our engineers to match the laser source, power, optical system, motion platform and processing strategy** to your application.

A: The most reliable way is to conduct a sample processing test using your actual ceramic material and geometry. We can evaluate cutting quality, hole quality, edge condition, dimensional accuracy and processing feasibility before you invest in equipment. Based on the test results, we can recommend the appropriate laser technology and machine configuration.