Your Professional Ultrafast Laser Micromachining Equipment Supplier！
Wuhan Yuchang Laser Technology Co., Ltd., established in 2017 and located in Wuhan East Lake High-tech Development Zone (China's Optics Valley), is a high-tech enterprise engaged in R&D, manufacturing, and sales. These products are widely applied in semiconductor chips, solar photovoltaics, new energy vehicles, advanced ceramics, aerospace, medical devices and other fields. We also provide laser processing services.
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![UV Nanosecond Laser Cutting Machine]()
UV Nanosecond Laser Cutting MachineEquipment Introduction This machine is equipped with an advanced 5-axis motion system , integrating a CNC control system, laser galvanometer head, linear motor stage, vision alignment system, and -
![Picosecond Laser Cutting Machine]()
Picosecond Laser Cutting MachineThe picosecond laser cutting machine is engineered for ultra-precision micromachining applications. By using ultrashort pulse laser technology, it enables cold processing with minimal heat diffusion, -
![Ultraviolet Picosecond Laser Cutting Machine]()
Ultraviolet Picosecond Laser Cutting MachineThe ultraviolet picosecond laser cutting machine uses a picosecond ultraviolet laser (<15ps) with a laser wavelength of 355nm. It’s suitable for high-speed laser etching, peeling, etching, scribing, -
![Infrared Picosecond Laser Cutting Machine]()
Infrared Picosecond Laser Cutting MachineThis equipment utilizes a picosecond infrared laser (1064nm), suitable for high-speed laser etching, stripping, etching, scribing, dicing, material removal, and fabrication on various material
Why Choose Us
High-Precision Laser Technology
YcLaser specializes in the R&D and manufacturing of high-precision laser equipment, achieving accuracy up to ±0.01mm. This ensures reliable, consistent results across diverse industrial applications.
Processing Capability
We support processing of ceramics, metals, PCB/FPC, and glass, covering 90% of industrial material requirements, from micro-holes and cutting to scribing and grooving.
Patented Core Technology
With 11 laser processing patents and optimized control algorithms, our equipment delivers 20% higher precision and efficiency, featuring auto-focus, visual positioning, and seamless integration with automated production lines.
Overview of Ultrafast Laser Micromachining Equipment
Ultrafast laser micromachining equipment uses lasers with extremely short pulses—typically in the femtosecond (10-15s) or picosecond (10-12s) range—to remove material with sub-micron precision without significant heat damage. This technology allows high-quality, cold ablation of metals, glass, ceramics, and polymers, producing features with minimal heat-affected zones (HAZ), slag, or burrs.
Product Specification
We offers the following product specifications:
| Item | Parameter |
| Laser | 1064nm 70W picosecond infrared laser |
| Laser Pulse Width | ＜30ps |
| Processing Area | 300x300mm |
| Single Cutting Area | 50x50mm |
| Minimum Focused Spot | 10μm |
| Minimum Aperture Width | 25μm |
| Laser Frequency Range | 100Hz-2000kHz |
| Minimum Etching Line Width | 10µm (ITO conductive glass) |
| Minimum Line Spacing | 15μm |
| Table positioning accuracy | ±2µm |
| Straightness | ±5μm |
| Table repeatability | ±2µm |
| Z-axis travel | 50mm |
| CCD auto-positioning accuracy | ±2µm |
| Scanning speed | Maximum speed 5000mm/s |
| Equipment dimensions | 1400mmL×1500mmW×1800mmH |
| Adsorption system | Fan airflow 100m³/h |
| Chiller | The water chiller has a temperature control range of 18℃~24℃ and a temperature control accuracy of ≤0.2℃. |
| Power consumption | 3000W |
| Software system | It features galvanometer scanning and platform movement linkage; it also has functions for controlling laser processing parameters; and it meets CAD file import requirements, accommodating drawings larger than 1GB for processing. |
| Equipment casing | The equipment is fully enclosed and has an internal door switch to prevent the laser from posing a danger to people. |
| Processable file formats | Standard DXF file |
Common types
Infrared Picosecond Laser Cutting Machine
This equipment utilizes a picosecond infrared laser (1064nm), suitable for high-speed laser etching, stripping, etching, scribing, dicing, material removal, and fabrication on various material surfaces. It can also perform micro-machining such as scribing and grooving on the surfaces of silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the requirements for cutting and drilling ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.).
Ultraviolet Picosecond Laser Cutting Machine
The ultraviolet picosecond laser cutting machine uses a picosecond ultraviolet laser (<15ps) with a laser wavelength of 355nm. It’s suitable for high-speed laser etching, peeling, etching, scribing, dicing, material removal, and fabrication on various material surfaces. Simultaneously, it can perform micro-machining such as scribing and grooving on the surfaces of materials such as silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the cutting and drilling needs of ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.).
Display and Touch Control Industry
LED/LCD Panel Cutting: Free of cracks and burrs, suitable for flexible screens, hard screens and special-shaped screens cutting.
Precise cutting and drilling of glass covers (such as phone covers, camera protection lenses).
Semiconductors and Microelectronics
Wafer slicing and cutting.
Microfabrication of packaging substrates.
Precise contour cutting and windowing of FPC and HDI boards.
Precision Optics and Optical Communication
Microstructural processing of hard and brittle materials such as optical glass, quartz, and sapphire.
Fine cutting and marking of optical fibers, optical waveguides, and filters.
New Energy Field
Non-scratched cutting of lithium battery electrode sheets (copper foil/aluminum foil).
Edge isolation, film opening and line marking of photovoltaic cells (PERC, TOPCon, HJT).
Other Services
All of our machines will be fully checked by our quality control department before the shipment. We guarantee all of our laser machines have a one-year warranty (quick-wear parts not included).
Training details: Operation principles, system, and structure, safety and maintenance, software processing technique, etc.
Numerous feedback from our clients have proven that our laser machines are stable in performance with rare malfunction. However, we would like to handle it as follows once malfunction occurs:
We guarantee that we will give you a clear reply within 24 hours.
Customer service staff will assist you in analyzing the malfunction to locate the cause.
If the malfunction is caused by improper operation of software and other soft faults, we will help solve the problem online.
We will offer plenty of online support, like detailed technical and installation instructions via email, video, and telephone.
FAQ
We are one of the most professional ultrafast laser micromachining equipment manufacturers and suppliers in China, also support customized service. Be free to buy industrial ultrafast laser micromachining equipment for sale here and get quotation from our factory. For price consultation, contact us.
Infrared Picosecond Laser Cutting Machine, Ultraviolet Picosecond Laser Cutting Machine, ultrafast laser micromachining equipment
