Product Description

The machine supports ultra-thin material processing while maintaining the integrity of multi-layer ceramic devices. It has been widely adopted in 5G communications, automotive electronics, aerospace, and high-end electronic manufacturing, improving device performance consistency and production yield.

Equipment Highlights & Advantages

Precision Control System

Vacuum adsorption for stable material handling
Latest CNC system controlling laser head, linear motor platform, and vision system in five-axis linkage

Low-Temperature Precision Machining

Ultra-short pulse UV laser (355nm) prevents carbonization and blistering
Ensures green ceramic material integrity

Multi-Layer Alignment System

High-precision CCD vision alignment automatically identifies ceramic alignment marks
Supports accurate multi-layer processing

Green Ceramic Dedicated Process Package

Built-in parameter database for mainstream LTCC/HTCC materials (DuPont, Ferro, etc.)
Intelligent parameter matching and automatic laser energy/scan strategy adjustment

Opto-Mechatronics Integration

CNC, laser, software, and vision integration
High flexibility, precision, and speed
Supports large-format, multi-pattern, multi-size engraving, cutting, and drilling

Quality Control Features

Real-time process monitoring and automatic defect detection
Post-processing cleaning for micro-dust removal
In-line production compatible with screen printing and laminating machines
Full-process data traceability adhering to automotive and aerospace standards

Technical Data

Item	Parameter
Laser wavelength	355nm UV laser
Laser output power	10-15W(optional)
Machining area (maximum)	400*400mm
Single cutting area:	50*50mm
Z-axis travel	50mm
Minimum focused spot	10µm
Table positioning accuracy	±3µm
Worktable repeatability	±2µm
CCD vision positioning accuracy	±3µm
Scanning speed	Max:4000mm/s
Equipment dimensions	1400mm (L) × 1500mm (W) × 1800mm (H) Maximum processing size 400*400mm, weight approximately 1500KG
Adsorption system	Fan airflow 100m³/h
Chiller	Water chiller temperature control range 18℃~24℃, temperature control accuracy ≤0.2℃
Power consumption	3000W
Software system	Features galvanometer scanning and platform movement linkage functions; Features functions for controlling laser processing parameters; Meets CAD file import requirements, supports importing and processing drawings larger than 1GB
Processable file formats	Standard DXF files.

Application Areas

Industry	Typical Components
Microwave / RF	5G filters, antenna modules, RF switches
Automotive Electronics	Sensors, control modules, ECU substrates
Medical Electronics	Microfluidic chips, implantable device substrates
Aerospace	High-density interconnect substrates, radiation-resistant modules

Key Application Processes

1. Through-hole / Blind-hole Array Machining

Aperture range: 0.03–0.5mm (minimum 30μm)
Aperture accuracy: ±5μm, hole wall perpendicularity >88°
Speed: up to 30,000 holes/hour (Ø0.1mm)

2. Precision Cutting of Green Ceramics

Cutting accuracy: ±0.01mm
Edge quality: burr-free, delamination-free, microcrack-free
Supports complex contours: arcs, sharp corners, and irregular shapes

3. Cavity and Step Machining

Multi-layer stepped structures supported
Depth control accuracy: ±2μm
3D structures: blind grooves, isolation grooves, and other 3D features

OEM & Customization Options

Adjustable laser power and machining area
Software parameter tuning for specific green ceramic materials
Tailored solutions for small-batch or high-precision multi-layer ceramic devices

Quality Control