The WHYC Laser High-Power Thick Silicon Nitride Ceramic Laser Cutting Machine is equipped with a 1000W QCW fiber laser, a high-rigidity motion platform, and dedicated thick-ceramic processing technology. Designed for processing 0.2–10 mm silicon nitride ceramics, it supports precision cutting of structural ceramic parts, ceramic plates, AMB substrates, insulation components, wear-resistant parts, and customized ceramic components.
Key Advantages
High-Power 1000W QCW Laser for Thick Ceramic Processing
Designed for processing thick silicon nitride ceramics up to 11mm, delivering higher cutting capability and stable machining quality for demanding industrial applications.
Optimized for Structural Ceramic Components
Suitable for precision cutting of ceramic plates, insulation components, wear-resistant parts, semiconductor fixtures, vacuum chuck components, and other complex ceramic structures.
Compatible with Si₃N₄-AMB Ceramic Substrates
Optimized processing strategies help reduce thermal influence on copper layers and improve machining consistency for AMB ceramic substrates used in power electronics.
High-Precision Motion Platform
Natural granite base, imported linear motors, and fully closed-loop grating feedback provide repeat positioning accuracy of ±5 μm for long-term production stability.
Large 600 × 600 mm Working Area
Supports large-format ceramic plates, multi-panel processing, and high-volume production while improving material utilization.
Built for Continuous Industrial Manufacturing
Fully enclosed machine structure with integrated dust extraction supports stable operation in advanced ceramic manufacturing environments.
Core Hardware Configuration
1000W QCW Fiber Laser System
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- 1060–1080nm
- high pulse energy
- optimized for Si₃N₄
Linear Motor Motion System
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- Imported linear motor
- 0.5μm grating feedback
- ±5μm repeat positioning accuracy
600×600mm Vacuum Platform
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- large processing area
- stable ceramic fixation
Intelligent CNC Control System
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- DXF
- contour cutting
- grooving
- array processing
Dust Extraction System
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- enclosed chamber
- ceramic particle collection
Technical Specifications
| Item | Specification |
| Laser Wavelength | 1060–1080 nm |
| Laser Power | 1000W QCW Fiber Laser |
| Working Area | 600 × 600 mm |
| Ceramic Thickness | 0.2–11 mm |
| Repeat Positioning Accuracy | ±5 μm |
| Processing Speed | 0–3000 mm/min |
| Maximum Travel Speed | 60 m/min |
| Maximum Acceleration | 1.2 G |
| Table Accuracy | ≤0.015 mm |
| Motion System | Imported Linear Motors + 0.5 μm Closed-Loop Grating |
| Machine Power | ≤7 kW (excluding dust collector) |
| Machine Weight | Approx. 1800 kg |
Typical Applications
Power Electronics
- Si₃N₄ AMB substrates
- SiC power modules
- GaN power modules
- High-voltage ceramic substrates
Precision Structural Ceramics
- Ceramic structural parts
- Ceramic support plates
- Ceramic insulation components
- Precision mechanical ceramic parts
Semiconductor Equipment
- Vacuum chuck components
- Ceramic end effectors
- Wafer handling parts
- Ceramic fixtures
Wear-Resistant Industrial Components
- Ceramic seal rings
- Ceramic valve components
- Guide plates
- Ceramic nozzles
- Pump components
New Energy & Aerospace
- EV powertrain ceramic components
- Energy storage systems
- Aerospace ceramic structures
- High-reliability industrial ceramic parts
Why Choose WHYC Laser?
Instead of relying on conventional mechanical machining or low-power laser systems, WHYC Laser provides a dedicated solution for thick silicon nitride ceramics, combining high-power laser technology with precision motion control and application-specific process optimization.
Whether your application involves power electronic substrates, structural ceramic components, semiconductor equipment, or industrial wear-resistant parts, our system is designed to deliver stable processing quality and high production efficiency.
Service & Support
Free sample processing and application evaluation
Customized process development
Installation, commissioning, and operator training
Remote technical support and software upgrades
Automation integration for production lines
Request a Free Sample Test
Whether you're processing thick Si₃N₄ ceramics, structural ceramic components, or AMB substrates, our application engineers can recommend the most suitable laser solution based on your material type, thickness, dimensional tolerance, and production requirements.
Contact WHYC Laser today to receive:
- Free sample processing and cutting evaluation
- Customized laser process recommendations
- Machine configuration proposals
- Fast technical consultation and quotations
Send us your drawings or ceramic samples, and let our engineers help you identify the most efficient laser solution for your application.
FAQ
Q1: What thickness of Si₃N₄ ceramics can this machine cut?
A:The machine is designed for 0.2–11mm Si₃N₄ ceramic processing, suitable for thick ceramic plates, Si₃N₄-AMB substrates, and precision ceramic components.
Q2: What applications can use this Si₃N₄ laser cutting machine?
A:It is widely used for power semiconductor components, semiconductor equipment ceramics, wear-resistant parts, and high-performance industrial ceramic components.
Q3: Why use a 1000W QCW laser for thick Si₃N₄?
A:The high-power QCW laser provides stronger penetration capability for thick Si₃N₄ ceramics, improving cutting efficiency and production stability.
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