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Description
Supports micro-hole arrays, tapered holes, stepped holes, and 3D contour channels with minimal thermal damage and high aspect ratio.
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Material Compatibility
Silicon nitride (Si₃N₄), alumina, zirconia, aluminum nitride, metallized ceramics, and composite substrates.
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Key Advantages
- Dedicated pulse sequences avoid micro-cracks during rapid thermal cycling
- Intelligent machining system automatically generates optimal laser paths for 3D models
- Real-time monitoring of the machining process
- Stores Si₃N₄ material parameters for varying densities and purities
Equipment Introduction
Mechanical & Control Design: Marble precision platform, gantry-type enclosed structure, magnetically levitated imported linear motor, 0.5 µm high-precision grating ruler, fully closed-loop bus CNC system
Automation & Vision: CCD visual positioning system for precise alignment; supports cutting and scribing of metallized ceramics and chip substrates
Laser Power: 1000 W (optional)
Applications: Micro-hole drilling, scribing, contouring, and heat dissipation channel machining
Technical data
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Item |
Parameter |
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Laser wavelength |
1060-1080nm |
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Laser output power |
1000W(optional) |
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Max.cutting range |
600*600mm |
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Cutting thickness |
0.2-8mm(Depending on material) |
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Precision of repeated positioning of X/Y axis |
±5um |
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Processing speed |
0-3000mm/min |
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Maximum acceleration |
1.2G |
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Worktable precision |
≦0.015mm |
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Transmission mode |
Imported linear motor +0.1um grating ruler |
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Whole machine power (no fan) |
≦7KW |
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Total weight of the whole machine |
About 1800KG |
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External dimension(length*width*height) |
1800*1470*1890mm (For reference) |
Application Scenarios
1. New Energy Vehicle Electric Drive Systems
IGBT power module substrates
Direct cooling micropore arrays
Double-sided cross-flow channels
Local heat dissipation structures for power terminals
2.Aerospace Hot-End Components
Turbine engine ceramic blades
Film cooling holes
Internal serpentine cooling channels
Anti-carbon deposition microstructures
Laser diode heat sinks
Microchannel cooling plates
High-density pin-fin array processing
Semiconductor equipment electrostatic chuck cooling holes
Phase change cooling vapor chambers (ceramic capillary core micropores, vapor return channels)
High-power LED integrated heat sinks (microchannel cold plates, optical windows, and thermal management structures simultaneously)
OEM & Customization Options
Customize your precision laser cutter to match your production needs with flexible configurations:
Working Area: Multiple standard & custom working sizes available
Laser Power: Wide range of laser power options for diverse material processing
Cutting Heads: Single head / Dual heads for improved efficiency
Worktable & Optical Path: Dual worktables + Dual optical paths for non-stop production
Visual Positioning: High-precision visual positioning system for accurate marking & cutting
Automation: Fully automatic loading & unloading system to save labor costs
After-Sales Service
Installation & commissioning: on-site or remote support
Operator training: workflow and maintenance guidance
Technical support: troubleshooting and process optimization
Spare parts and long-term maintenance support
FAQ
Q: Q1: Can the machine process deep micro-holes in Si₃N₄ components?
A: A1: Yes, Please contact us to discuss the specific details.
Q: Q2: What hole types can it handle?
A: A2: Round holes, irregular holes,and tapered holes.
Q: Q3: Is it suitable for high-power vehicle IGBT substrates?
A: A3: Yes, it is can used for extreme thermal management and micro-channel processing in EV power modules.
Q: Q4: Can it handle aerospace and industrial ceramic heat sinks?
A: A4: Yes, it supports turbine blade cooling channels, vapor chambers, and microchannel LED heat sinks.
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