Small Format Ceramic Laser Cutting Machine

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Small Format Ceramic Laser Cutting Machine
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This Small-Format Ceramic Laser Cutting Machine is a laser precision machining system designed specifically for processing small-sized, high-precision ceramic and electronic substrates. It integrates a high-performance fiber laser, a precision marble platform, linear motor drive, and nanometer-level closed-loop control.
Category
Zirconium Oxide (ZrO2) Ceramic Laser Cutting Machine
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Description

 

Product Description

 

 

This Small-Format Ceramic Laser Cutting Machine is a laser precision machining system designed specifically for processing small-sized, high-precision ceramic and electronic substrates. It integrates a high-performance fiber laser, a precision marble platform, linear motor drive, and nanometer-level closed-loop control. Within a compact area of ≤300×300mm, it achieves a repeatability accuracy of ±5μm, making it ideal for processing ceramic substrates, micro-ceramic components, precision molds, and small new energy ceramic devices. It is particularly suitable for use in upstairs offices or laboratories.

 

Our Advantages

 

Precision Laser Source, Superior Processing Quality

YCLASER Small Format Ceramic Laser Cutting Machine utilizes a specially designed 1060–1080 nm fiber laser with excellent beam quality (superior M² value) and a finely focused spot. This machine ensures smooth, chip-free, burr-free cutting and drilling edges with a minimal heat-affected zone, delivering consistently high processing quality.

01

Flexible Power Options

Our machine supports a full power range from 150W to 1000W fiber lasers, allowing precise matching to different material thicknesses and processing efficiency requirements. From ultra-fine micro-hole cutting to thick ceramic plate processing, the YCLASER system provides comprehensive application coverage.

02

High-rigidity platform with excellent dynamic performance

Marble gantry dual-drive integrated structure: The natural marble base ensures excellent thermal stability and shock resistance; the dual-drive gantry design significantly improves rigidity and synchronization accuracy under high-speed movement.

03

Linear motor direct-drive system:

This laser machine is equipped with a magnetic levitation linear motor and a 0.5 μm ultra-high-resolution grating ruler, forming a fully closed-loop control system. It achieves high-speed movement of up to 50 m/min and ultra-high repeatability positioning accuracy of ±5 μm, fully meeting the stringent requirements of micro-hole arrays and complex contour machining.

04

Intelligent integration for flexible applications:

It can seamlessly integrate with a CCD vision positioning system, automatically identifying material edges, mark points, or internal circuits, easily handling the precision machining of materials such as metallized ceramics and copper-aluminum substrates, improving the processing yield and efficiency of complex products.

05

 

Technical data

 

 

Item

Parameter

Laser Wavelength

1060-1080nm

Laser Power

150W-300W(optional)

Cutting Width

≤300*300mm

Cutting Thickness

0.2-5mm (Depending on material)

X/Y Axis Repeatability

±5um

Processing Speed

0-2000mm/min

Maximum Travel Speed

50m/min

Processing accuracy

±0.01-0.02mm

Worktable precision

≦0.015mm

Transmission Method

linear motor +0.5um grating ruler

Total Machine Power (excluding fan)

≦5KW

Total Machine Weight

About 1200KG

External Dimensions (L*W*H)

1050*1300*1850mm

 

Our equipment offers a variety of power and configuration options to meet the processing needs of different thicknesses and materials.

 

Specifications

Product picture

Laser Power

Wavelength

Cutting Area

Cutting Thickness

Equipment Dimensions (Estimated)

YC-TC01

product-105-105

150w Customization

1060-1080nm

300x300mm

0.2-2mm

1400x1500x1800mm

YC-TCSF

product-112-112

150w-300w optional

1060-1080nm

300x300mm

0.2-5mm

1050x1300x1850mm

YC-TCHP

product-105-105

450-1000wCustomization

1060-1080nm

600x600mm

0.2-10mm

1800x1470x1890mm

YC-TCAT

product-106-106

150w

Customization

1060-1080nm

220x220mm

0.2-2mm

1750x1405x1920mm

YC-UVP

product-106-106

10-30w optional

355nm

400x400mm

≤0.2mm

1500x1600x1800mm

 

 

Typical Processing Applications

 

 

1. PCB and Electronic Packaging:

Precision cutting, drilling, and shaping of ceramic circuit boards (DCB, DPC, AMB), chip packaging substrates, and LTCC/HTCC ceramic circuit boards.

2. 3C Consumer Electronics:

Ceramic backplates/mid-frames for mobile phones, structural components for smart wearable devices, miniature acoustic ceramic components, and ceramic bases for LED sensors.

3. Precision Industrial Ceramics:

Cutting and drilling of small ceramic sealing rings and miniature ceramic samples for scientific research.

4. New Energy and Semiconductors:

Ceramic bipolar plates for hydrogen fuel cells, ceramic cores for automotive sensors, photovoltaic ceramic suction cups, and small-sized ceramic parts for semiconductor equipment.

This equipment is specifically designed for fields with extremely high requirements for precision and space efficiency. Please contact us for customized process testing and detailed technical information.

 

FAQ

 

 

Q1: What materials can this machine process?

A:This machine is designed for high-precision processing of hard and brittle materials, including alumina (Al₂O₃), zirconia (ZrO₂), aluminum nitride (AlN), silicon carbide (SiC), glass, and piezoelectric ceramics.

Q2: Is sample testing available?

A: Yes, we provide free or paid sample testing (depending on complexity).Customers can send materials for evaluation before purchase.

Q3: How much does this machine cost?

A: Pricing depends on configuration and customization requirements. Generallystarting from USD 35,000. Please contact us for a detailed quotation and tailored solution.

Q4: What is the processing accuracy?

A: The system can achieve high precision with a typical tolerance of ±50 μm or better, depending on the application and configuration.

Q5: Will there be chipping or micro-cracks on the edges?

A: With optimized parameters, no micro-cracks, and excellent edge quality.

Q6: Do you provide manuals and training?

A: Yes, an electronic user manual will be sent after shipment for translation and reference. Optional on-site installation support is available, along with training on operation, software usage, and routine maintenance.

Q7: Do your machines have CE certification?

A: Yclaser holds over 11 laser processing patents and has obtained CE certification and ISO quality management system certification. Additional certifications can be provided upon request.

Q8: What about warranty and after-sales service?

A: We provide a 1-year warranty for the entire machine, long-term spare parts supply, fast replacement of key components, and lifetime technical support after the warranty period.

 

 

 

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