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Description
High-precision laser drilling for micro-hole arrays on seals and functional ceramic parts.
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Key Advantages
- Flexible power options: 150W–1000W
- Cutting/drilling thickness: 0.2–5mm (material dependent)
- Minimal heat-affected zone and high surface quality
- Contactless processing reduces mechanical stress and cracking
- High stability for long-term production
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Specifications
Max cutting range: 300 × 400mm; Repositioning precision: ±5µm; Machining accuracy: ±0.01–0.02mm.
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Technical Highlights
Equipped with marble precision platform, gantry dual-drive closed structure, magnetic levitation linear motor, 0.5µm high-precision grating ruler, and full closed-loop CNC system.
OEM & Customization Options
We offer flexible customization to meet the unique requirements of industrial and high-tech applications:
Customizable Features: Machine design, laser power, drilling range, software programming, and material compatibility.
Tailored Solutions: Ideal for small-batch or specialized ceramic component production.
Quality Control
Production Process: Strict workflow ensures consistency and stability.
Inspection & Testing: Accuracy, repeatability, and surface quality are thoroughly verified.
Quality Commitment: Complies with international industrial standards.
Certification: Available upon request to verify compliance.
After-Sales Service
Packaging & Logistics: Secure packaging and shipping options for safe delivery.
Installation & Commissioning: On-site or remote setup support.
Training & Usage: Professional operator and maintenance training.
Technical Support: Ongoing assistance for troubleshooting and process optimization.
Maintenance & Spare Parts: Long-term service support and spare parts availability.
Other Information
Sample Testing: Available to validate processing parameters and material compatibility.
Applications: Fuel cell seals, semiconductor equipment sealing rings, aerospace sensor seals, high-temperature valve seals.
Pricing & Payment: Flexible options available.
Agency & Partnership: Opportunities for distributors and agents worldwide.
Technical Data
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Item |
Parameter |
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Laser wavelength |
1060-1080nm |
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Laser output power |
150W-1000W(optional) |
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Max.cutting range |
300*400mm |
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Cutting thickness |
0.2-5mm(Depending on material) |
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Precision of repeated positioning of X/Y axis |
±5µm |
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Processing speed |
0-2000mm/min |
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Maximum distance speed |
50m/min |
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Machining accuracy |
±0.01-0.02mm |
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Worktable precision |
≦0.015mm |
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Transmission mode |
Imported linear motor +0.1µm grating ruler |
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Whole machine power (no fan) |
≦5KW |
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Total weight of the whole machine |
About 1200KG |
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External dimension(length*width*height) |
1150*1500*1850mm(For reference) |
Component Application Scenarios
Micropore arrays (0.05–0.2mm) on proton exchange membranes for hydrogen-oxygen ion channels.
Balance holes (0.1–0.5mm) machined on ceramic rings for vacuum chamber pressure regulation.
Signal transmission hole arrays on protective covers.
Drainage and pressure balance holes on valve seats.
FAQ
Q1: Can I test my sample before placing an order?
A1: Yes, we provide sample drilling to ensure compatibility and quality.
Q2: What is the warranty period?
A2: Standard warranty is 12 months, with optional extended service plans.
Q3: Do you provide training for operators?
A3: Yes, on-site or remote training is available.
Q4: Can the machine be customized for different power or drilling range?
A4: Absolutely. OEM options include laser power, worktable size, software, and material compatibility.
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