What’s the Difference Between Infrared and Ultraviolet Lasers?

Apr 22, 2026

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The main difference between infrared (IR) and ultraviolet (UV) lasers lies in their wavelength, which directly affects processing principles, precision, material compatibility, and cost. In simple terms, infrared lasers are typically used for thermal processing, while ultraviolet lasers are better suited for "cold processing."


Below is a parameter comparison of YCLaser's infrared picosecond laser cutting machines and ultraviolet picosecond laser cutting machines.

 

ItemParameter (UV)Parameter (IR)
Laser355nm 10- 30W picosecond infrared laser1064nm 50W picosecond infrared laser
Laser Pulse Width<15ps<30ps
Processing Area400x400mm500x600mm
Single Cutting Area50x50mm50x50mm
Minimum line width8μm10μm
Laser frequency range100Hz-2000kHz100Hz-2000kHz
Minimum Aperture Width/25μm
Minimum Etching Line Width/10um (ITO conductive glass)
Minimum line spacing10μm15μm
Table positioning accuracy±2um±2um
Straightness±5μm±5μm
Table repeatability±2um±2um
Z-axis travel50mm50mm
CCD auto-positioning accuracy±2um±2um
Scanning speedMaximum speed 5000mm/sMaximum speed 10000mm/s
Equipment dimensions1500mmL×1650mmW×1800mmH1500mmL×1600mmW×1800mmH
Adsorption systemFan airflow 100m3/hFan airflow 100m3/h
ChillerThe water chiller has a temperature control range of 18℃~24℃ and a temperature control accuracy of ≤0.2℃.
Power consumption3000W
Software systemIt features galvanometer scanning and platform movement linkage; it also has functions for controlling laser processing parameters; and it meets CAD file import requirements, accommodating drawings larger than 1GB for processing.
Equipment casingThe equipment is fully enclosed and has an internal door switch to prevent the laser from posing a danger to people.
Processable file formatsStandard DXF file

 

 

Core differences

Comparison Dimensions:Infrared Laser (IR Laser)Ultraviolet Laser (UV Laser)
Typical Wavelength:1064 nm (Common)355 nm (Common)
Processing Principle:Hot Processing: Melting and vaporizing materials with thermal energyCold Processing: Breaking molecular bonds with high-energy photons
Precision:Lower precision, larger spot sizeExtremely high precision, extremely small spot size
Thermal Impact Factors:Significant, prone to thermal damage areasMinimal, almost no thermal damage
Applicable Materials:Metals, wood, acrylic, etc.Plastics, glass, ceramics, metal surfaces
CostRelatively economical in terms of equipment purchase and maintenance costs, long lifespanRelatively high cost, high maintenance requirements
FeaturesExcellent at rapid cutting, welding, and deep engraving of hard materials such as metals.Ultra-short wavelengths can be focused into extremely small spots, enabling micron- or even nanometer-level processing with smooth, burr-free edges.
ApplicationsAutomotive manufacturing, aerospace, industrial marking, etc.Precision manufacturing fields such as semiconductors, PCBs (printed circuit boards), medical devices, and displays.

 

How to Choose?
YCLaser can recommend the most suitable and cost-effective solution based on your specific materials, precision requirements, and production needs. Feel free to contact us for more details.

 

 

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