What’s the Difference Between Infrared and Ultraviolet Lasers?

Apr 22, 2026

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The main difference between infrared (IR) and ultraviolet (UV) lasers lies in their wavelength, which directly affects processing principles, precision, material compatibility, and cost. In simple terms, infrared lasers are typically used for thermal processing, while ultraviolet lasers are better suited for "cold processing."


Below is a parameter comparison of YCLaser's infrared picosecond laser cutting machines and ultraviolet picosecond laser cutting machines.

 

Item

Parameter (UV)

Parameter (IR)

Laser

355nm 10- 30W picosecond infrared laser

1064nm 50W picosecond infrared laser

Laser Pulse Width

<15ps

<30ps

Processing Area

400x400mm

500x600mm

Single Cutting Area

50x50mm

50x50mm

Minimum line width

8μm

10μm

Laser frequency range

100Hz-2000kHz

100Hz-2000kHz

Minimum Aperture Width

/

25μm

Minimum Etching Line Width

/

10um (ITO conductive glass)

Minimum line spacing

10μm

15μm

Table positioning accuracy

±2um

±2um

Straightness

±5μm

±5μm

Table repeatability

±2um

±2um

Z-axis travel

50mm

50mm

CCD auto-positioning accuracy

±2um

±2um

Scanning speed

Maximum speed 5000mm/s

Maximum speed 10000mm/s

Equipment dimensions

1500mmL×1650mmW×1800mmH

1500mmL×1600mmW×1800mmH

Adsorption system

Fan airflow 100m3/h

Fan airflow 100m3/h

Chiller

The water chiller has a temperature control range of 18℃~24℃ and a temperature control accuracy of ≤0.2℃.

Power consumption

3000W

Software system

It features galvanometer scanning and platform movement linkage; it also has functions for controlling laser processing parameters; and it meets CAD file import requirements, accommodating drawings larger than 1GB for processing.

Equipment casing

The equipment is fully enclosed and has an internal door switch to prevent the laser from posing a danger to people.

Processable file formats

Standard DXF file

 

 

Core differences

Comparison Dimensions:

Infrared Laser (IR Laser)

Ultraviolet Laser (UV Laser)

Typical Wavelength:

1064 nm (Common)

355 nm (Common)

Processing Principle:

Hot Processing: Melting and vaporizing materials with thermal energy

Cold Processing: Breaking molecular bonds with high-energy photons

Precision:

Lower precision, larger spot size

Extremely high precision, extremely small spot size

Thermal Impact Factors:

Significant, prone to thermal damage areas

Minimal, almost no thermal damage

Applicable Materials:

Metals, wood, acrylic, etc.

Plastics, glass, ceramics, metal surfaces

Cost

Relatively economical in terms of equipment purchase and maintenance costs, long lifespan

Relatively high cost, high maintenance requirements

Features

Excellent at rapid cutting, welding, and deep engraving of hard materials such as metals.

Ultra-short wavelengths can be focused into extremely small spots, enabling micron- or even nanometer-level processing with smooth, burr-free edges.

Applications

Automotive manufacturing, aerospace, industrial marking, etc.

Precision manufacturing fields such as semiconductors, PCBs (printed circuit boards), medical devices, and displays.

 

How to Choose?
YCLaser can recommend the most suitable and cost-effective solution based on your specific materials, precision requirements, and production needs. Feel free to contact us for more details.

 

 

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