Product Description
This equipment is primarily used for high-precision cutting of ceramic substrates. It's an economical precision laser cutting solution optimized for the large-scale production needs of PCB ceramic substrates. Using different lasers, it can also be used for cutting and drilling advanced precision ceramics such as alumina, zirconium oxide, aluminum nitride, and silicon nitride.
Equipment Introduction
This PCB ceramic laser cutting machine is equipped with a precision mechanical platform, employing high-precision imported linear motors and a fully closed-loop optical encoder. It uses European electrical components and control systems, providing a solid guarantee for the large-scale manufacturing of power semiconductors and RF modules with industrial-grade reliability and outstanding cost-effectiveness.
Advantages
High-efficiency production:
Supports 24/7 continuous production, with a mean time between failures (MTBF) > 30,000 hours.
01
Inspection system (optional):
CCD automatic measurement of key dimensions, compared with drawings.
02
Operation training:
Provides systematic training to ensure customers can operate independently and perform basic maintenance.
03
Processing data traceability:
Records complete processing parameters, time, and operator information for each substrate.
04
Long-term process support:
Free process development support for new materials.
05
Technical data
|
Item |
Parameter |
|
Laser wavelength |
1060-1080nm |
|
Laser output power |
150W(optional) |
|
Max.cutting range |
600*600mm |
|
Precision of repeated positioning of X/Y axis |
±5µm |
|
Processing speed |
0-500mm/s |
|
Maximum acceleration |
1.2G |
|
CCD visual positioning accuracy |
±5µm |
|
Worktable precision |
≦0.015mm |
|
Transmission mode |
Imported linear motor +0.5µm grating ruler |
|
Whole machine power (no fan) |
≦7KW |
|
Total weight of the whole machine |
About 1800KG |
|
External dimension(length*width*height) |
1800*1470*1890mm (For reference) |
Applications
1. Power semiconductor module packaging:
High-precision dicing, slotting, and contour cutting of ceramic substrates (such as DBC, AMB) in IGBT and SiC/GaN power devices.
2. LED ceramic substrate manufacturing:
Laser processing of micro-hole arrays, irregular contours, and insulating grooves for alumina (Al₂O₃) or aluminum nitride (AlN) LED brackets/substrates.
3. RF device assembly production:
The PCB ceramic laser cutting machine suitable for fine cutting and through-hole drilling of LTCC/HTCC ceramic filters, antenna substrates, and package housings.
4. Electronic ceramic structural component processing:
Covering non-destructive forming of precision oxide/nitride ceramic components such as sensor bases, insulators, and vacuum capacitor housings.
5. High-end PCB and substrate manufacturing:
Meeting the localized precision cutting needs of PCB factories for ceramic-filled high-frequency boards, metal substrates (IMS), or embedded ceramic areas.
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