Product Description
This PCB substrate precision laser cutting machine is designed for precision cutting, depaneling, slotting, and drilling of rigid PCB substrates (FR4, aluminum base, copper base), FPC flexible circuits, HDI high-density interconnect boards, alumina/aluminum nitride ceramic substrates, and composite material substrates. Compared to traditional mechanical depaneling with router or blade, laser cutting is stress-free, preventing circuit cracking, delamination, and component damage. It is suitable for high-end electronic manufacturing in 5G communications, consumer electronics, automotive electronics, new energy, and aerospace industries.
Advantages
Stress-Free Depaneling
No mechanical contact; eliminates PCB delamination, solder joint cracking, and component damage caused by traditional router/blade depaneling.
Ultra-High Cutting Precision
Positioning accuracy ±0.005mm; minimum cutting line width 20μm, meeting stringent requirements of precision ceramic substrates.
Carbonization-Free & Burr-Free
Clean cutting edges without thermal residue or black carbonized edges.
Multi-Material Compatibility
Single machine supports FR4, copper base, aluminum base, ceramic substrates, FPC, and more; switching parameters without changing machines.
Visual Auto-Alignment
CCD vision system automatically recognizes Mark points and compensates for substrate deformation, ensuring consistent batch cutting.
High-Speed & Efficient
Galvo scanning head max speed up to 10,000mm/s; combined with high-precision XY linear motor platform for optimal speed and accuracy.
Product Specifications
Our equipment offers a variety of power and configuration options to meet the processing needs of different thicknesses and materials.
|
Specifications |
Product picture |
Laser Power |
Wavelength |
Cutting Area |
Cutting Thickness |
Equipment Dimensions (Estimated) |
|
YC-GJMD |
|
150w-300W optional |
1060-1080nm |
300x300mm |
0.2-1.5mm |
1050x1300x1850mm |
| YC-GJM01 |
|
1500w-3000w |
1060-1080nm |
600x600mm,800*800,1000*1000 |
0.2-5mm |
1800x1470x1890mm |
|
YC-GJMPCB |
|
1000w Customization |
1060-1080nm |
600x600mm |
0.2-2mm |
1800x1470x1890mm |
|
YC-UVP |
|
10-30w optional |
355nm |
400x400mm |
≤0.2mm |
1500x1600x1800mm |
Technical Data
Fiber Laser Version
|
Item |
Parameter |
|
Laser Wavelength |
1060–1080nm |
|
Laser Output Power |
1000W Customizable |
|
Max Cutting Range |
600×600mm |
|
X/Y Axis Repeat Positioning Accuracy |
±5µm |
|
Processing Speed |
0–500mm/s |
|
Maximum Acceleration |
1.2G |
|
CCD Visual Positioning Accuracy |
±5µm |
|
Worktable Precision |
≤0.015mm |
|
Transmission Mode |
Imported linear motor + 0.5µm grating ruler |
|
Whole Machine Power (No Fan) |
≤7KW |
|
Total Machine Weight |
~1800KG |
|
External Dimensions (L×W×H) |
1800×1470×1890mm |
UV Laser Version
|
Item |
Parameter |
|
Laser |
355nm, 10–30W Picosecond UV Laser |
|
Laser Pulse Width |
<15ps |
|
Processing Area |
400×400mm |
|
Single Cutting Area |
50×50mm |
|
Minimum Line Width |
8μm |
|
Laser Frequency Range |
100Hz–2000kHz |
|
Minimum Line Spacing |
10μm |
|
Table Positioning Accuracy |
±2µm |
|
Straightness |
±5µm |
|
Table Repeatability |
±2µm |
|
Z-Axis Travel |
50mm |
|
CCD Auto-Positioning Accuracy |
±2µm |
|
Scanning Speed |
Max 5000mm/s |
|
Equipment Dimensions |
1500×1650×1800mm |
|
Adsorption System |
Fan airflow 100m³/h |
|
Chiller |
Water chiller temperature range 18–24°C, accuracy ≤0.2°C |
|
Power Consumption |
3000W |
Our Services
Sample Service
Free sample cutting service available. Customers provide PCB/FPC/ceramic substrate samples; we deliver cut section photos, accuracy reports, and cut samples for evaluation before order placement.
Quality Control
Continuous cutting stability test for 48 hours before shipment; complete sample cutting reports included.
ISO 9001:2015 certified; laser power stability ±1%, spot consistency calibrated per unit; key components fully traceable.
1-year machine warranty; 1-year laser warranty; positioning accuracy and cutting edge quality guaranteed in writing; shipment after sample confirmation.
CE / ISO 9001 / FDA / RoHS certification provided based on country requirements.
After-Sales Service
- Packaging & Logistics: Anti-vibration wooden case with moisture-proof packaging; supports air/sea shipping, FOB/CIF, fully insured.
- Installation & Commissioning: On-site engineer setup including optical path calibration, vision system alignment, UV & fiber laser process tuning; cutting accuracy acceptance report provided.
- Training: 5–7 days covering operation and basic maintenance; English manuals and video tutorials; remote training supported.
- Support: 24/7 technical hotline; remote diagnosis <2 hours; on-site support for major failures.
- Maintenance: Annual preventive maintenance plan; support for long-term service contracts.
- Spare Parts: Globally stocked consumables including focusing lenses, protective lenses, and galvo mirrors; DHL/FedEx 48-hour delivery; optional pre-stocked spare kits.
Application Industries
1. PCB Manufacturing
Applicable for copper, aluminum, and ceramic PCB manufacturing, especially for copper/aluminum reinforcement layers in FPC flexible boards.
Applications: 5G modules, smartphone motherboards & flexible screen connections, automotive ECUs & ADAS sensors, medical high-reliability boards, aerospace multilayer boards, semiconductor packaging substrates, power module aluminum/ceramic substrates, humanoid robot control boards.
2. 3C Electronics
Small thin-walled metal structures, especially post-stamping 2D laser processing for digital device housings.
3. Other Industries
Precision microprocessing of thin metal, ceramic, and alloy substrates.
FAQ
Q: How to choose between UV and fiber laser for PCB cutting?
A: UV laser (355nm, 5–30W) is suitable for FPC flexible boards, HDI high-density boards, ceramic substrates (alumina/aluminum nitride), and small-size precision PCBs. Cold processing with heat-affected zone <50μm; edges are carbonization- and burr-free.
Fiber laser (1064nm, 150–3000W) is suitable for thick copper PCBs, aluminum substrates, and high-metal-content boards. High-power fiber lasers are faster but produce larger heat-affected zones; for non-metal FR4, edges may carbonize, so UV is preferred for high-precision depaneling.
Q: Will laser depaneling damage PCB components or solder joints?
A: No. Compared to router or blade depaneling, laser cutting is stress-free and vibration-free, ideal for stress-sensitive components like BGA or QFN. UV cold laser keeps heat-affected zones within 50μm, avoiding thermal damage.
Q: Can the machine handle warped FPCs?
A: Yes. Optional CCD vision system automatically recognizes Mark points and compensates for substrate deformation in real time; compensation accuracy ≤5μm, ensuring precise cutting.
Q: Requirements for cutting ceramic substrates (alumina/aluminum nitride)?
A: Customers can send samples for laser testing. Multiple process schemes are provided, showing different laser processing results. Optimal process is selected based on material thickness and properties.
Q: Equipment price and payment terms?
A: Price depends on configuration and customization. Contact us for detailed quotation and solution.
Payment: T/T bank transfer; 30% deposit, 60% before shipment, 10% balance after acceptance.
Q: Agency & Resale
A: Retail: Minimum order 1 unit; full technical support and after-sales provided; delivered to factory standards.
Wholesale: For large-scale production, system integrators, or distributors; bulk orders supported; regional exclusive agency and rebate policies available.
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