Description

High-performance fiber nanosecond laser ensures precise, chip-free cutting and drilling of AlN and other high-reliability substrates.
Material Compatibility

AlN, metallized ceramic PCBs, high-thermal-conductivity substrates
Equipment Introduction
- Mechanical Design: High-stability marble platform with XY-axis separated closed-frame structure for rigidity, vibration resistance, and motion stability
- Control System: Linear motor with 0.1 μm grating ruler and fully closed-loop CNC system
- Laser Power: 150 W (optional)
- Operational Stability: Supports 24/7 continuous operation; laser lifespan >50,000 hours; maintenance-free period >2,000 hours
- Environmental Adaptability: Operating temperature 10–35 ℃, humidity 30–70% RH
- Safety: CE certified, Class 1 laser safety

Technical Data

Item	Parameter
Laser wavelength	1060-1080nm
Laser output power	150W(optional)
Max.cutting range	300*300mm
Cutting thickness	0.2-2mm(Depending on material)
Precision of repeated positioning of X/Y axis	±3μm
Processing speed	0-2500mm/min
Maximum acceleration	1.0G
Machining accuracy	±0.01-0.02mm
Worktable precision	≦0.015mm
Transmission mode	linear motor +0.1μm grating ruler
Whole machine power (no fan)	≦6KW
Total weight of the whole machine	About 1700KG
External dimension(lengthwidthheight)	140015001800mm (For reference)

Why choose us?

1. Guaranteed Processing Quality Standards

Edge chipping <30 μm, no delamination cracks
Hole wall roughness Ra <1.2 μm, controllable taper 0–15°
Dimensional consistency: CPK >1.33
Surface condition: No slag, no carbonization

2. Reliable Production

24/7 continuous operation
High laser lifespan and extended maintenance-free periods
Environmentally adaptable for humidity and temperature variations
CE certified and Class 1 laser safety

3. Technical Service Support

Free sample processing and parameter development
On-site operation and maintenance training, remote support
Spare parts inventory with 24-hour response
Lifetime software upgrades and modular hardware upgrades

Applicable Industries: Power semiconductor packaging, new energy vehicle electronics, 5G communications equipment, industrial power supplies, aerospace electronics, and other high-reliability electronic manufacturing fields.

OEM & Customization Options

Laser power, cutting range, and software parameters customizable
Tailored solutions for high-precision AlN and ceramic PCB substrates
Supports both small-batch prototyping and large-volume production

Quality Control

CCD visual positioning for precise μm-level alignment
Real-time monitoring and defect detection
Ensures chip-free cutting, consistent hole quality, and mass production reliability

After-Sales Service