Introduction of Equipment
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Minimum Pore Size
50–100μm (up to 20μm for ultra-fine holes)
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Description
Utilizes a spiral scanning trajectory to achieve high aspect ratio, crack-free micro-holes with exceptional roundness and surface quality.
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Applications
Widely used in consumer electronics, semiconductor, automotive, LED/optoelectronics, and medical industries.
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Key Advantages
- Contactless processing avoids micro-cracks and edge chipping
- High-speed drilling: ~20 holes per second
- Minimal thermal impact preserves material properties
- High repeatability and stability for batch production
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Mechanical Design
Marble precision platform with XY cross-module cld structure ensures rigidity, shock resistance, and high-speed stability.
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Automation Features
CCD visual positioning system and left-right automatic loading/unloading for efficient process
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Versatility
Supports cutting and marking on metalized ceramics and ceramic substrates.
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Laser Power Options
500–1000W, wavelength 1060–1080nm
OEM & Customization Options
Customizable Features: Laser power, cutting range, software programming, worktable size, and material compatibility.
Tailored Solutions: Ideal for small-batch or high-precision production in specialized industries.
Quality Control
Production Process: Strict workflow ensures stable and precise drilling results.
Inspection & Testing: Accuracy, verticality, roundness, and surface quality are verified for every batch.
Quality Commitment: Compliant with industrial and electronics standards.
Certification: Available upon request.
After-Sales Service
Packaging & Logistics: Secure packaging for safe delivery.
Installation & Commissioning: On-site or remote support.
Training & Operation Guidance: Professional training for operators.
Technical Support: Assistance with troubleshooting and process optimization.
Maintenance & Spare Parts: Long-term service support and replacement parts available.
Technical Data
Item
Parameter
Laser wavelength
1060-1080nm
Laser output power
500-1000W(optional)
Max.cutting range
300*300mm
Drilling holes per second
20
Cutting thickness
0.1-1mm(Depending on material)
Precision of repeated positioning of X/Y axis
±3µm
Minimum aperture
10µm
Processing speed
0-3000mm/min
Maximum acceleration
1.0G
Worktable precision
≦0.015mm
Transmission mode
Imported linear motor +0.1µm grating ruler
Whole machine power (no fan)
≦6KW
Total weight of the whole machine
About 1500KG
External dimension(length*width*height)
1500*1400*1800mm(For reference)
Component Application Scenarios
Industry
Application
Drilling Requirements
Advantages
Consumer electronics
Alumina ceramic back cover and mid-frame for mobile phones/watches
Antenna hole, microphone hole (Φ0.1–0.5mm)
High roundness, no edge chipping, compatible with 5G signals
Semiconductor equipment
Vacuum cavity insulating ring, wafer carrier disk
Cooling holes and positioning holes
(Φ0.5–2mm, thickness 2–5mm)
The deep hole has good verticality and reliable sealing.
Automotive electronics
Alumina spark plug insulator, sensor housing
Exhaust vent, sensor through-hole (Φ1–3mm)
High temperature resistance, no pollution, stable in batches
LED/optoelectronics
Alumina substrate (thick film circuit)
Through holes/heat dissipation holes (Φ0.2–1mm)
The hole walls are smooth and do not affect circuit performance.
Medical equipment
Alumina surgical instrument handles, dental frames
Assembly holes, flow channel holes
Biocompatibility is unaffected by thermal damage
FAQ
Q1: Can I test my sample before ordering?
A1: Yes, sample drilling is available to ensure compatibility and quality.
Q2: What is the warranty period?
A2: Standard warranty is 12 months, with optional extended service plans.
Q3: Do you provide training for operators?
A3: Yes, on-site or remote training is available.
Q4: Can the machine be customized for different laser power or drilling range?
A4: Absolutely. OEM options include laser power, worktable size, software, and material compatibility.
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