Picosecond Laser Cutting Machine

The picosecond laser cutting machine is engineered for ultra-precision micromachining applications. By using ultrashort pulse laser technology, it enables "cold processing" with minimal heat diffusion, resulting in clean, sharp edges, reduced chipping, and excellent surface quality.

The system supports dual-wavelength options (UV and infrared), providing flexible processing for a wide range of materials, including hard and brittle materials, transparent and heat-sensitive substrates, and various polymers. It is well-suited for high-end applications that require micro- and nano-scale precision with minimal heat-affected zones.

• Picosecond "Cold Processing" with Minimal Thermal Impact:
Utilizing ultra-short pulse picosecond laser technology, the heat-affected zone is extremely small, effectively avoiding issues such as deformation, carbonization, and edge chipping. It is ideal for high-precision processing of brittle, ultra-thin, and heat-sensitive materials, helping improve overall product yield.

• Ultra-High Precision and Stability:
Equipped with a high-precision motion control system and CCD vision positioning, it achieves micron-level accuracy with excellent repeatability. It enables stable processing of complex geometries and high-density micro-holes, meeting the strict requirements of advanced electronics and semiconductor applications.

• High Efficiency and Cost Optimization:
Designed for batch processing applications such as HTCC/LTCC green ceramic sheets, it supports high-speed cutting and drilling. The dual-station configuration allows simultaneous processing and loading/unloading, improving throughput and reducing per-unit processing costs.

• Fully Enclosed Design for Safety and Cleanroom Use:
The fully enclosed integrated structure effectively contains laser radiation, processing dust, and noise, meeting cleanroom and precision manufacturing environment standards while ensuring operator safety.

• Wide Material Compatibility:
Capable of processing a broad range of materials, including ceramics, semiconductors, glass, metals, polymers, and composites. One machine covers multiple applications, reducing equipment investment and maintenance costs, and supporting flexible production across different batch sizes.

• Intelligent Operation and Easy Maintenance:
Features an integrated touchscreen interface with intuitive controls, supporting graphical programming, automatic positioning, and auto-focusing, reducing operator skill requirements and improving ease of use.

• Durable and Stable Structure:
The marble worktable and integrated welded frame provide high rigidity and vibration resistance, ensuring stable operation and consistent precision, while enhancing durability and extending service life.

Our equipment offers a variety of power and configuration options to meet the processing needs of different thicknesses and materials.

 

 

Application Areas

01.

HTCC / LTCC Co-fired Ceramic Green Sheet Processing

As core equipment for HTCC and LTCC green sheet processing, this system utilizes picosecond "cold processing" to achieve high-speed, high-precision cutting and micro-hole drilling:

• Enables precision cutting of complex circuit patterns, irregular contours, and high-density micro-holes (down to tens of micrometers), with no chipping, burrs, or heat-affected zones, preserving green strength and sintering compatibility;
• Suitable for multilayer stacking and positioning hole processing, meeting the strict requirements of ceramic packaging substrates in 5G RF modules, microwave devices, sensors, and automotive electronics, while improving yield and production efficiency compared to traditional mechanical methods.

02.

Semiconductor and Brittle Material Micromachining

Designed for hard and brittle materials such as silicon wafers, ceramics, sapphire, and glass, enabling high-precision scribing, cutting, drilling, and etching:

• Silicon wafers: Supports stealth cutting, scribing, and grooving of ultra-thin wafers without chipping or cracking, suitable for power semiconductors, MEMS, and wafer-level packaging;
• Sapphire / glass: Ideal for mobile cover glass, optical lenses, display panels, and glass wafers, delivering smooth edges without stress or post-polishing;
• Ceramics: Processes alumina, zirconia, aluminum nitride, and other substrates with precision scribing, grooving, and drilling for power devices, sensors, and 5G components.

 

03.

Precision Processing of Ultra-Thin Materials

Enables non-destructive, high-precision cutting and drilling of ultra-thin flexible and rigid materials, addressing deformation and tearing issues in conventional processing:

• Ultra-thin metals: Copper, aluminum, stainless steel, nickel, tungsten, etc., for precision contour cutting and micro-hole processing in flexible circuits and battery components;
• Polymers and composites: PET, PI, PEEK, carbon fiber, and glass fiber composites, achieving clean cutting and etching without thermal deformation, suitable for flexible electronics, new energy, and aerospace;
• Special ultra-thin substrates: Ultra-thin glass, silicon wafers, and graphene films, meeting the demands of advanced applications such as flexible displays and semiconductors.

04.

Versatile Micromachining Across Multiple Materials

Supports precision surface processing for a wide range of materials:

• Metals: Stainless steel, aluminum alloys, copper alloys, titanium alloys, enabling precision etching, micro-structuring, and marking for medical devices, precision components, and electronics;
• Polymers: Plastics, rubber, and resins, enabling clean cutting, etching, and marking without heat deformation, suitable for consumer electronics, medical products, and automotive parts;
• Special materials: Silicon carbide, gallium nitride, quartz, and ceramic matrix composites, supporting high-precision micromachining for power electronics and aerospace applications.

Three-layer protective packaging ensures safe delivery: the inner layer uses anti-static film, the middle layer is reinforced with high-density foam, and the outer layer is sealed in a durable wooden crate. This structure effectively protects against vibration and moisture during transit.

Supports sea, air, and land transportation, with full-process tracking to ensure safe and timely delivery.

YCLaser provides a one-year warranty for the entire machine, lifetime maintenance support, and free replacement of non-human-damaged parts during the warranty period.

Our service team responds within 24 hours, offering remote video support as the first step. If needed, on-site technical service can be arranged. After the warranty period, we continue to provide comprehensive hardware and software support, along with lifetime system upgrades.