Ultraviolet Picosecond Laser Cutting Machine

The ultraviolet picosecond laser cutting machine uses a picosecond ultraviolet laser (<15ps) with a laser wavelength of 355nm. It's suitable for high-speed laser etching, peeling, etching, scribing, dicing, material removal, and fabrication on various material surfaces. Simultaneously, it can perform micro-machining such as scribing and grooving on the surfaces of materials such as silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the cutting and drilling needs of ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.). It is the ultimate manufacturing tool for cutting-edge fields such as precision electronics, biomedicine, and scientific research.

The ultraviolet picosecond ultrafast laser micro-nano processing equipment is equipped with a 30W ultraviolet picosecond laser. It uses independently developed control software to adjust the galvanometer and linear motor in real time. After importing CAD data, the CCD vision positioning system automatically etches the laser. Combined with an ultra-precision motion and optical system, intelligent monitoring and control system, electric lifting worktable, and unique dust removal system, it achieves near-perfect processing quality.

The dual technological advantages of UV + picosecond: High photon energy directly breaks the chemical bonds of materials, achieving "cold" processing; Extremely small focused spot size, high absorption for most materials, eliminating carbonization during processing; Picosecond pulse width (<15ps), heat-affected zone approaches zero, materials are directly vaporized and removed without microcracks, maintaining the original mechanical properties of the material.