The Aluminum Nitride (AlN) Power Module Laser Cutting Machine is specially developed for precision machining of AlN ceramic substrates used in high-power semiconductor packaging. It is fully compatible with alumina ceramic processing and supports cutting, drilling, scribing, isolation groove machining, and precision contour processing on AlN power module substrates.
Equipped with a 150W QCW fiber laser as standard, the machine delivers high processing efficiency for high-thermal-conductivity AlN ceramics. A
355 nm UV laser is available for applications requiring finer features and lower thermal impact.
Designed for automotive, power electronics, renewable energy, and semiconductor manufacturing, the system provides stable, high-yield production while minimizing thermal damage and material loss.
Key Features
Prevent Thermal Cracks in AlN Ceramics
The optimized multi-pass cutting process effectively reduces thermal stress, helping prevent edge chipping and thermal cracking during machining.
Minimize Aluminum Precipitation
Precise laser energy control suppresses aluminum precipitation on cut edges, improving insulation performance and reducing the risk of electrical leakage.
Compatible with Metallized AlN substrates
Supports bare AlN ceramics, metallized AlN substrates, AlN DBC, and AlN AMB substrates while minimizing damage to copper layers and bonding interfaces.
Semiconductor-Level Precision
- Repeatability: ±3 μm
- Stable linear motor platform
- High-resolution vision alignment
- Excellent contour accuracy for complex power module designs
Wide Material Compatibility
Suitable for:
- Bare Aluminum Nitride (AlN)
- Metallized AlN
- AlN DBC Substrates
- AlN AMBsubstrates
Ceramic thickness:
0.2–2 mm (depending on material)
Core Configuration
150W QCW fiber laser (standard)
Optional355nm UV nanosecond laser
Imported linear motor transmission
0.1 μm grating scale
Full closed-loop CNC motion system
High-precision CCD vision positioning
Natural granite machine base
Vacuum adsorption platform
Industrial dust extraction system
Technical Specifications
| Item | Specification |
| Laser Wavelength | 1060–1080 nm |
| Laser Power | 150 W (Customizable) |
| Processing Area | 300 × 300 mm |
| Cutting Thickness | 0.2–2 mm (Depending on Material) |
| Repeat Positioning Accuracy | ±3 μm |
| Processing Speed | 0–2500 mm/min |
| Maximum Travel Speed | 60 m/min |
| Maximum Acceleration | 1.0 G |
| Worktable Accuracy | ≤0.015 mm |
| Transmission System | Imported Linear Motor + 0.1 μm Grating Scale |
| Machine Power | ≤6 kW (excluding dust collector) |
| Machine Weight | Approx. 1700 kg |
| Machine Dimensions | 1400 × 1500 × 1800 mm |
Typical Applications
Suitable for precision machining of:
- SiC Power Module Substrates
- GaN Power Electronics
- EV Traction Inverters
- On-board Chargers (OBC)
- Energy Storage Power Modules
- Railway Traction Systems
- 5G RF Power Devices
- Aerospace Power Electronics
- High-Power Laser Cooling Modules
Why Choose the YCLASER AlN Power Module Laser Cutting Machine?
With extensive experience in ceramic laser processing, YCLASER provides complete laser machining solutions for AlN ceramic substrates, including free sample testing, process optimization, equipment customization, installation, and technical support.
The Aluminum Nitride Power Module Laser Cutting Machine is an ideal solution for precision machining of AlN ceramic substrates used in next-generation power electronics. It delivers high accuracy, excellent edge quality, and reliable processing for bare and metallized AlN substrates while meeting the demanding requirements of semiconductor, EV, energy storage, and industrial power module manufacturing.
Contact YCLASER today for free sample testing and customized laser processing solutions.
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