LED Sensor Ceramic Laser Drilling Machine

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LED Sensor Ceramic Laser Drilling Machine
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The LED Sensor Ceramic Laser Drilling Machine is designed for precision micro-machining of ceramic substrates used in LED and sensor applications. Built on our proven precision laser processing platform, the system integrates a high-performance fiber laser to perform micro drilling, precision...
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Al₂O₃ Laser Cutting Machine
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Description

The LED Sensor Ceramic Laser Drilling Machine is designed for precision micro-machining of ceramic substrates used in LED and sensor applications. Built on our proven precision laser processing platform, the system integrates a high-performance fiber laser to perform micro drilling, precision cutting, and scribing in one machine.

 

It is ideal for machining advanced ceramics such as Alumina (Al₂O₃), Aluminum Nitride (AlN), Zirconia (ZrO₂), HTCC, and LTCC, overcoming common issues associated with conventional machining, including edge chipping, cracking, low accuracy, contamination, and poor efficiency.

Typical applications include LED ceramic packages, sensor substrates, thermal dissipation hole arrays, blind holes, positioning holes, and precision ceramic substrate cutting for industries such as consumer electronics, automotive sensors, and semiconductor packaging.

 

Key Features

 

 

1.Dual Laser Options for Different Applications

Choose the laser source that best fits your production requirements:

QCW Fiber Nanosecond Laser – High efficiency and stable performance for through holes, medium and large hole diameters, and batch production.

 

UV Nanosecond Laser (Optional) – Cold laser processing with virtually no chipping or carbonization, ideal for ultra-small holes, blind holes, thin ceramics, and complex hole geometries.

2.Micron-Level Machining Accuracy

Minimum hole diameter: 0.05 mm, Position accuracy: ±2 μm, Hole roundness: ±5–10 μm, Hole wall roughness: Ra ≤1 μm, Heat affected zone: <50 μm, Yield rate: ≥99.5%

3.Stable Structure for Continuous Production

A granite machine base combined with a linear motor drive and full closed-loop servo system ensures excellent stability and repeatability.

 

Repeat positioning accuracy: ±5 μm

Laser lifetime: Up to 100,000 hours

Low maintenance and consumable costs

Suitable for 24/7 automated production

4.Cutting, Drilling & Marking in One Machine

One machine completes:Precision ceramic cutting,Micro-hole drilling,Scribing and laser marking

 

This integrated solution minimizes production steps, reduces floor space, lowers investment costs, and can improve production efficiency by more than 5 times.

5.Easy Operation

The machine features:CCD vision positioning (optional),Auto focus,Graphic programming interface,Automatic error alarm

Operators can quickly learn the system without extensive laser processing experience.

 

Technical Specifications

 

 

ItemSpecification
Laser Wavelength1060–1080 nm
Laser Power150–1000 W (Optional)
Working Area≤300 × 400 mm
Cutting Thickness0.2–10 mm (Depending on material)
X/Y Repeat Positioning Accuracy±5 μm
Processing Speed0–2000 mm/min
Maximum Travel Speed50 m/min
Machining Accuracy±0.01–0.02 mm
Worktable Precision≤0.015 mm
Drive SystemImported Linear Motor + 0.5 μm Linear Scale
Machine Power (Without Fan)≤5 kW
Machine WeightApprox. 1200 kg
Machine Dimensions1150 × 1500 × 1850 mm

Specifications are subject to the actual machine configuration.
 

Compatible Materials

 

 

The machine is suitable for machining various advanced ceramic materials, including:

  • Alumina Ceramic (Al₂O₃)
  • Aluminum Nitride Ceramic (AlN)
  • Zirconia Ceramic (ZrO₂)
  • HTCC Ceramic
  • LTCC Ceramic
  • Silicon Nitride Ceramic (Si₃N₄)
Typical Applications
 

LED Ceramic Components

Positioning holes,Heat dissipation hole arrays,Electrode through holes

Sensor Ceramic Substrates

Precision blind holes,Micro-hole arrays,Mounting holes

Ceramic Substrates

Precision cutting,Edge grooving,Laser scribing and marking

Automotive Sensors

High-reliability micro holes,Special-shaped holes,Precision ceramic component machining

LED Sensor Ceramic Sample

Standard Configuration
 

Core Light Source

QCW fiber nanosecond/ultraviolet nanosecond laser (optional)

Motion Platform

.Marble bed, linear motor, high-precision guide rail;

Control System

Industrial computer, dedicated laser control software;

Vision System

CCD automatic positioning (optional), focusing system

Auxiliary System

High-precision dust removal, constant temperature cooling, safety protection

User Interface

15-inch touchscreen, graphical programming.

Service & Support

 
 
 
 

Free Sample Processing

Send us your ceramic samples for free testing. A machining evaluation report will be provided.

 

 
 
 

Customized Solutions

We recommend the most suitable machine configuration based on your material, hole size, precision requirements, and production capacity.

 

 
 
 

Installation & Training

Professional installation, commissioning, and operator training are provided to ensure a smooth start-up.

 

 
 
 

Warranty

1-year machine warranty

Lifetime technical support

 

 
 
 

Fast Technical Support

Our engineers are available 24/7 to provide prompt technical assistance.

 

 

 

Watch Processing Videos

Click the link below to view real machining videos of our ceramic laser processing equipment.

Video - Wuhan Yuchang Laser Technology Co., Ltd.

 

 

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