The HTCC Alumina Ceramic Laser Cutting Machine is engineered for precision machining of High Temperature Co-fired Ceramic (HTCC) substrates before and after sintering. It is widely used in the production of RF and microwave packages, radar modules, SiC power electronics, MEMS hermetic sensors, and automotive high-temperature sensor components.

HTCC ceramics are manufactured at firing temperatures of 1400–1600°C, resulting in extremely dense, hard ceramic substrates with embedded tungsten or molybdenum conductors. Conventional punching or mechanical machining often causes layer separation, cavity deformation, micro-cracks, or damage to internal metallization.

Our dedicated HTCC laser system is equipped with a QCW fiber nanosecond laser as standard, with optional UV nanosecond and UV picosecond upgrades. Combined with a granite linear motor platform, dual CCD vision alignment, and an enclosed dust extraction system, the machine performs high-precision drilling, cutting, cavity machining, scribing, and profile processing while protecting delicate internal metal circuits.

Designed for both R&D and high-volume manufacturing, it delivers stable performance for continuous 24/7 production.

Typical Processing Applications

 

• Micro drilling
• Through holes
• Blind holes
• Alignment holes
• Multilayer cavity machining
• Panel dicing
• Profile cutting
• Side-wall drilling Hermetic sealing grooves
• Ceramic package machining

 

 

 

 

QCW Fiber Nanosecond Laser

The machine is equipped with a 1064 nm QCW fiber nanosecond laser, offering:

High peak power with low average heat input,Adjustable pulse frequency,Minimum focused spot size of 20 μm, Long service life,Low maintenance and operating costs,Excellent protection for embedded tungsten and molybdenum metallization.

Optional Laser Sources:

355 nm UV Nanosecond Laser:Ideal for: Ultra-thin HTCC green sheets,Dense micro-hole arrays,Fine cavity machining,Reduced thermal damage

UV Picosecond Laser: Recommended for:

Ultra-small holes (<50 μm),Hermetic ceramic packages,Military and aerospace applications,High-end optoelectronic devices,Virtually heat-free machining

High-Precision Linear Motor Platform

The rigid granite platform provides exceptional stability for multilayer HTCC processing.

Features include:Natural granite machine base,Full closed-loop linear motor drive,High-resolution linear scales,Positioning accuracy: ±2 μm, Repeatability: ±3 μm, Working areas available: 300 × 300 mm,400 × 500 mm,500 × 600 mm

The system ensures consistent alignment across large-format HTCC panels while minimizing dimensional variation during production.

Dual CCD Vision Alignment

The optional dual-camera vision system automatically detects alignment marks and compensates for: Mechanical positioning errors,Thermal expansion,Fixture deformation,Multilayer alignment deviations

Overall hole positioning accuracy is maintained within ±20 μm, meeting the requirements of precision HTCC package manufacturing.

The software supports DXF and CAD file import for automatic layout generation and batch production.

Enclosed Dust Extraction System

The fully enclosed machining chamber is designed for cleanroom-compatible HTCC processing.

Its synchronized negative-pressure dust collection system removes ceramic particles and metal oxides immediately during machining, reducing contamination, preventing blocked micro-holes, and protecting embedded metallization.

The chamber also incorporates anti-reflection shielding to minimize laser reflection inside the work area.

Intelligent Control Software

The dedicated ceramic laser software includes optimized process libraries for both green and sintered HTCC materials.

Functions include: One-click parameter selection,Automatic path optimization,Layer-by-layer cavity machining,Real-time monitoring of laser power, pulse frequency, coordinates, and temperature,Automatic alarms and production data recording,Support for automated loading and unloading systems

Specifications are subject to the final machine configuration.

Request a Free Sample Test

If you are experiencing challenges such as layer separation, metallization damage, poor hole accuracy, cavity deformation, or low production yield, our HTCC laser cutting machine offers a reliable solution for precision manufacturing.

For ultra-thin HTCC green sheets, hermetic ceramic packages, or ultra-fine micro-hole applications, the machine can be upgraded with UV nanosecond or UV picosecond laser technology.

Contact us today to arrange a free sample evaluation and receive a customized processing solution and quotation.

Check our cutting video:Video - Wuhan Yuchang Laser Technology Co., Ltd.