Product Overview
The YCLASER silicon nitride power module laser cutting machine is a professional ceramic laser processing equipment developed for new energy vehicles, electric drive systems, energy storage inverters, industrial frequency converters, rail transportation, and high-end power electronics fields.
This equipment uses a 1060-1080nm high-stability fiber laser system, combined with a high-precision linear motor platform, vision positioning system, and a dedicated ceramic processing technology database, enabling high-precision cutting, irregular contour processing, grooving, and scribing of silicon nitride ceramic substrates.
Core Advantages
1. Laser technology for silicon nitride ceramics
Silicon nitride has high hardness, high toughness, and high thermal conductivity, requiring extremely high stability in laser processing.
The equipment establishes a dedicated process database for Si₃N₄materials, and through multi-segment energy control and optimized scanning strategies, achieves the following:
● Reduced risk of edge chipping
● Reduced thermal cracking
● Improved cut perpendicularity
● Enhanced cut edge quality
● Improved AMB substrate processing consistency
Suitable for:
● 0.2-2mm silicon nitride ceramic substrates
● AMB copper-clad silicon nitride substrates
● Power module insulating substrates
● Heat dissipation ceramic structural components The cut edges are neat and smooth, allowing direct entry into subsequent metallization, soldering, and packaging processes.
2.Linear Motor Platform
The equipment adopts an imported linear motor drive system and a 0.1μm high-resolution grating ruler for full closed-loop control.
Main Performance Indicators:
● X/Y axis repeatability: ±3μm
● Table accuracy: ≤0.015mm
● Maximum travel speed: 60m/min
● Maximum acceleration: 1.0G
Even with complex contours, small dimensions, or high-density layout products, it can maintain stable processing accuracy and product consistency.
Particularly suitable for:
● IGBT substrate outline cutting
● SiC module substrate processing
● High-density packaging substrate cutting
● Small-size irregular-shaped ceramic processing
3. High-efficiency processing capability
Targeting the mass production needs of the power module industry, the equipment balances processing quality and production efficiency.
● Processing speed: 0-2500mm/min
● Maximum processing range: 300×300mm
● Automatic path optimization
● Continuous and stable operation
Capable of meeting:
● New product R&D prototyping
● Small-batch trial production
● Medium-batch stable mass production
Helping companies shorten delivery cycles and improve equipment utilization.
4. Low heat-affected zone, improving product reliability
Power module substrates are ultimately used in high-temperature, high-pressure, and high-frequency environments.
The equipment effectively reduces thermal stress concentration by precisely controlling laser energy input.
After processing, the following can be achieved:
● Lower heat-affected zone
● Fewer microcrack risks
● Better edge integrity
● Higher insulation reliability
Especially suitable for high-reliability applications such as new energy vehicle drive systems and industrial power modules.
5. Stable and reliable industrial design
The entire machine adopts a high-rigidity structural design, ensuring stable and reliable long-term operation.
Equipment Features:
● Natural marble platform structure
● Fully enclosed protective design
● Industrial-grade control system
● Modular maintenance structure
● Long-term continuous production capacity
Total machine power (excluding fan) ≤ 6KW, reducing energy consumption and operating costs while ensuring processing performance.
Typical Processing Capabilities
Power Semiconductor Substrates
●AMB Substrates
●IGBT Ceramic Substrates
●SiC Power Module Substrates
●MOSFET Power Module Substrates
●Electric Drive Inverter Substrates
New Energy Vehicle Field
●OBC On-Board Charger Substrates
●DC/DC Converter Substrates
●Main Drive Inverter Substrates
●Battery Management System Heat Dissipation Substrates
Industrial and Energy Fields
●Energy Storage Inverter Substrates
●Photovoltaic Inverter Module Substrates
●Wind Power Converter Module Substrates
●Industrial Servo Drive Module Substrates
Technical Parameters
| Item | Parameters |
| Laser Wavelength | 1060-1080nm |
| Laser Power | 150W (Customizable) |
| Maximum Processing Range | 300×300mm |
| Processing Thickness | 0.2-2mm |
| X/Y Axis Repeat Positioning Accuracy | ±3μm |
| Processing Speed | 0-2500mm/min |
| Maximum Moving Speed | 60m/min |
| Maximum Acceleration | 1.0G |
| Table Accuracy | ≤0.015mm |
| Transmission method | Imported linear motor + 0.1μm grating ruler |
| Total power | ≤6KW (excluding fan) |
| Total weight | Approx. 1700KG |
| Dimensions | 1400×1500×1800mm |
Why Choose YCLASER Silicon Nitride Laser Cutting Machine?
Compared to traditional mechanical cutting, diamond wheel cutting, and waterjet processing, YClaser silicon nitride laser cutting machines achieve:
✓ Lower chipping rate
✓ Higher processing accuracy
✓ Smaller heat-affected zone
✓ Higher product consistency
✓ Lower consumable costs
✓ More flexible irregular shape processing capabilities
✓ Better suited for power semiconductor ceramic substrate manufacturing
Whether it's IGBT modules for new energy vehicles, SiC power device packaging, or industrial power electronic module production, WHYC can provide stable and reliable silicon nitride ceramic laser processing solutions, helping customers improve product yield, reduce manufacturing costs, and achieve efficient mass production.
FAQ
Q: What thickness of silicon nitride (Si₃N₄) substrate can this laser cutting machine process?
A: This machine is designed to process silicon nitride ceramic substrates with a thickness from 0.2 mm to 2 mm. We can also customize higher-power laser cutting machines for cutting thicker materials. Please contact us, and we will customize a solution based on your specific application needs.
Q: Can this machine process AMB substrates and other ceramic materials?
A: Yes. Besides silicon nitride AMB substrates, this machine can process a variety of advanced ceramic materials, including: aluminum nitride, alumina (Al₂O₃), zirconium oxide, silicon carbide, DBC and DPC ceramic substrates, and other hard and brittle ceramic materials.
Processing parameters can be customized according to different materials, thicknesses, and production requirements.
Q: Does WHYC provide sample testing before equipment purchase?
A: Yes. WHYC provides free sample testing and process evaluation services. Customers can send materials, drawings, or processing requirements to our engineering team. Based on the sample evaluation results, we will recommend the most suitable laser configuration and provide a processing report to help customers verify cutting quality, production efficiency, and project feasibility before investing in equipment.
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