Silicon Nitride Automotive Substrate Laser Drilling Machine

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Silicon Nitride Automotive Substrate Laser Drilling Machine
Details
The YCLASER Silicon Nitride Automotive Power Module Substrate Laser Drilling Machine is specifically developed for precision drilling of through holes, blind holes, positioning holes, slots, and micro-features in advanced ceramic substrates. Equipped with a high-power QCW fiber laser, high-precision linear motor platform, and CCD vision positioning system, the machine delivers fast, stable, and highly accurate laser drilling performance for automotive-grade ceramic components.
Category
Silicon Nitride (Si₃N₄) Ceramic Laser Cutting Machine
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Description

Product Overview

 

 

The YCLASER Silicon Nitride Automotive Power Module Substrate Laser Drilling Machine is specifically developed for precision drilling of through holes, blind holes, positioning holes, slots, and micro-features in advanced ceramic substrates. Equipped with a high-power QCW fiber laser, high-precision linear motor platform, and CCD vision positioning system, the machine delivers fast, stable, and highly accurate laser drilling performance for automotive-grade ceramic components.

 

Technical Specifications

 

 

ItemSpecification
Laser Wavelength1060–1080nm
Laser TypeQCW Fiber Laser
Laser Output Power1000W (Customized)
Maximum Processing Area600 × 600 mm
Processing Thickness0.2–10mm (Depending on Material)
X/Y Repeat Positioning Accuracy±5μm
Processing Speed0–3000 mm/min
Maximum Travel Speed60 m/min
Maximum Acceleration1.2G
Worktable Accuracy≤0.015 mm
Transmission SystemImported Linear Motor + 0.5μm Grating Ruler
Whole Machine Power (Without Fan)≤7KW
Total Machine WeightAbout 1800KG
Machine Dimensions (L × W × H)1800 × 1470 × 1890 mm
Power SupplyAC 220V / 380V Optional

 

Specifications may vary according to configuration and application requirements.

 

Typical applications include
 

IGBT Power Module Substrates

Precision drilling for high-power semiconductor packaging substrates used in electric vehicles and industrial drives.

SiC Power Module Ceramic Substrates

High-precision hole processing for next-generation SiC power devices requiring excellent thermal management performance.

EV Power Control Systems

Laser drilling of ceramic substrates used in inverters, onboard chargers, DC/DC converters, and power control units.

High-Temperature Ceramic Components

Processing of ceramic parts used in automotive sensors, gas turbines, and harsh-environment electronic systems.

 

Typical Sample

 

 

typical sample

 

Technical Advantages

 

 

si3n4 test demension

 

High Precision Laser Drilling

 
 

Designed for demanding automotive and semiconductor applications requiring exceptional dimensional accuracy.

  • Minimum hole diameter: ≥50μm
  • Hole diameter range: 50μm – 1.3mm
  • Hole taper: <1°
  • Ra≤1.6μm
  • Minimum focused spot size: 30μm
  • Positioning accuracy: ±5μm
  • Smooth hole wall quality

Excellent consistency for mass production

Reliable Industrial Design

 

Reliable Industrial Design

 
 

The machine is built for long-term industrial production environments.

Features include:

  • Heavy-duty naturalmarblemachine base
  • Fully enclosed safety structure
  • Imported linear motor drive system
  • High-resolution grating ruler feedback
  • Industrial-grade laser source
  • Stable thermal management system
Smart Vision Positioning System

 

Smart Vision Positioning System

 

 

Equipped with an advanced CCD vision system for automatic alignment and positioning.

 

Benefits:

  • Automatic fiducial recognition
  • Precise substrate positioning
  • Improved processing consistency
  • Reduced operator intervention
Powerful Software Control

 

Powerful Software Control

 

 

The self-developed control software supports:

  • DXF file import
  • AutoCAD compatibility
  • CorelDRAW compatibility
  • Flexible NC programming
  • Custom graphic editing
  • Automatic path optimization

Ideal for both prototype development and volume production.

 

FAQ

 
 

Q: What is the minimum hole diameter achievable in silicon nitride ceramic substrates?

A: The machine can produce holes as small as 50μm, depending on substrate thickness, hole geometry, and material characteristics.

Q: Can the machine process both through holes and blind holes?

A: Yes. The system supports through-hole drilling, blind-hole drilling, micro-slots, positioning holes, and customized micro-structure machining.

Q: Which materials can be processed besides silicon nitride?

A: The machine is compatible with a variety of advanced ceramics, including AlN, Al₂O₃, DBC substrates, DPC substrates, zirconia, silicon carbide, LTCC, and HTCC ceramics.

Q: Is the machine suitable for automotive power module production?

A: Yes. It is specifically designed for automotive-grade applications such as IGBT modules, SiC MOSFET modules, EV inverters, onboard chargers (OBC), and power control units (PCU).

Q: Do you provide sample testing?

A: Yes. We offer free sample processing and feasibility testing. Customers are welcome to send drawings and samples for evaluation before purchasing.

 

Contact Us

 

 

Looking for a reliable solution for silicon nitride ceramic substrate drilling?

WHYC Laser provides:

✓ Free sample testing

✓ Process evaluation

✓ Customized automation solutions

✓ Global technical support

✓ Professional ceramic laser processing expertise

Contact us today to discuss your application requirements and receive a customized laser drilling solution for your power module manufacturing project.

 

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