Products Description
The SiC Power Device Wafer Laser Dicing Machine is specifically designed for precision singulation and dicing of silicon carbide (SiC) wafers, power semiconductor devices, and advanced ceramic substrates.
Equipped with a high-power fiber laser, ultra-precision motion platform, and CCD vision alignment system, the machine delivers high-speed, high-accuracy processing while minimizing chipping, micro-cracks, and thermal damage.
The system is particularly suitable for third-generation semiconductor manufacturing,like power modules and semiconductor packaging substrates.
Equipment Features
High-Power Fiber Laser Technology
- Advanced industrial-grade fiber laser source
- Excellent beam quality and energy stability
- Maintenance-free operation
- High electro-optical conversion efficiency
- Low operating cost
Ultra-Precision Motion Platform
- Natural granite machine base for superior rigidity
- Integrated gantry structure ensures vibration resistance
- High-speed and high-stability operation
Linear Motor Drive System
- Imported linear motor system
- 0.5μm high-resolution linear encoder
- Full closed-loop CNC control
- Fast response and superior positioning accuracy
CCD Vision Alignment
- Automatic wafer alignment
- Fiducial recognitio
- High-precision positioning for semiconductor applications
Low-Damage Laser Dicing
- Narrow kerf width
- Minimal chipping
- Reduced thermal influence zone
Improved die yield
Applications
Third-Generation Semiconductor Industry
SiC Power Device Wafers
SiC MOSFET Wafers
SiC Schottky Diodes
SiC Power Modules
SiC Packaging Substrates
Semiconductor Packaging Industry
Ceramic Substrates
DBC Substrates
AMB Substrates
AlN Substrates
Semiconductor Carriers
New Energy Industry
Electric Vehicle Power Modules
Charging Systems
Energy Storage Systems
Photovoltaic Inverters
Industrial Electronics
High-Power Semiconductor Components
Intelligent Manufacturing Equipment
Industrial Drives
Rail Transit Electronics
Technical Specifications
| Item | Parameter |
Laser Type
| Fiber Laser
|
Laser Wavelength
| 1060–1080 nm
|
Laser Power
| 1000 W (Customized)
|
Processing Area
| 600 × 600 mm
|
Cutting Thickness
| Depends on Material
|
Repeatability Accuracy
| ±5 μm
|
Processing Speed
| 0–3000 mm/min
|
Maximum Travel Speed
| 60 m/min
|
Maximum Acceleration
| 1.2 G
|
Worktable Accuracy
| ≤0.015 mm
|
Drive System
| Imported Linear Motor + 0.5 μm Encoder
|
Machine Power
| ≤7 kW
|
Machine Weight
| About 1800 kg
|
Machine Dimensions
| 1800 × 1470 × 1890 mm
|
Advantages for SiC Wafer Dicing
High Precision
Supports precision dicing of SiC wafers and semiconductor substrates with excellent dimensional consistency.
Low Chipping
Optimized laser processing minimizes edge defects and improves die quality.
High Yield
Reduces micro-cracks and thermal stress, helping improve final device yield.
Flexible Processing
Suitable for straight-line cutting, wafer singulation, grooving, drilling, and customized semiconductor processing.
Automation Ready
Compatible with semiconductor production lines and customized automation solutions.
Typical Processing Samples
- SiC Power Device Wafers
- SiC MOSFET Wafers
- DBC Ceramic Substrates
- AMB Ceramic Substrates
- AlN Ceramic Substrates
- Semiconductor Packaging Carriers
- Advanced Ceramic Components
Sample Applications
Semiconductor equipment ceramic suction cups
Watch Our Laser Cutting Video.
After-Sales & Support Services
Free SiC Wafer Sampling
Complimentary processing of 4", 6", and 8" SiC wafers. Includes cross-section inspection, electrical tests, and full mass-production process solutions.
Preloaded Semiconductor Process Package
Comes with mature "stealth dicing" parameters for all SiC wafers. No in-house tuning needed-stable production from day one.
Premium Warranty & Lifetime Support
One-year full-machine warranty, plus free lifetime updates, process optimization, and technical consultation.
On-Site Installation & Training
Engineers handle installation and commissioning. Operator training ensures quick and smooth production start.
24/7 Rapid Technical Support
Round-the-clock remote troubleshooting and emergency on-site service to prevent production downtime.
Customized Automation Integration
Optional fully automated loading/unloading systems for unmanned mass production.
For cross-section reports, mass-production videos, precise quotes, or tailored production plans, contact our team for a free one-on-one consultation on high-end SiC processing solutions.
Our address
1st Floor, Building B, Phoenix Park, No.8, Optics Valley Science and Technology Park, No.18, Gaoxin 6th Road, Jiangxia District, Wuhan City
Phone Number
+8618602711568
FAQ
Q: What materials can your machine process?
A: Compatible with advanced ceramics, LTCC green tape, glass, sapphire, quartz,PCB/FPC, wafer, ultra-thin metal, lithium battery foil and other hard & brittle precision materials. Optional laser sources for multi-purpose processing.
Q: What's the minimum drill hole and positioning accuracy?
A: Min. hole diameter 0.05mm, repeat positioning accuracy +2um, fit mass production of 3C, semiconductor and optical components.
Q: What laser sources are installed on your machines? Are theywell-known branded lasers?
A: A: We configure lasers with different wavelengths and output powers tailored to your processing requirements. Our equipment is fitted with self-developed laser sources as standard; alternatively, specified branded lasers can be installed upon customers request.
Q: Is 24h unattended mass production available?
A: A: Our machine adopts full closed-loop CNC control; optional auto loading/unloading and dual worktable enable 24-hour unattended automatic production. However,periodic short rest intervals after long continuous operation help extend the equipment service life effectively.
Hot Tags: sic power device wafer laser dicing machine, China sic power device wafer laser dicing machine manufacturers, suppliers, factory
