Equipment Introduction
The machine is equipped with a high-power fiber laser system for precision cutting, drilling and scribing of advanced ceramics. Optimized for ultra-hard materials including silicon carbide (SiC), it features outstanding precision, high throughput and great production flexibility for photovoltaic, semiconductor and industrial ceramic industries.
Key Features
Micron-level drilling and cutting with smooth, burr-free edges.
Processes SiC, Al₂O₃, AlN, Si₃N₄, and metallized ceramics with high reliability.
Cutting speeds up to 3000mm/min, compatible with automation for mass production.
Non-contact processing eliminates tool wear. Fiber laser requires minimal maintenance and low operating cost.
Integrated Vision System (Optional)
CCD-based alignment enables precise marking, cutting, and scribing of chip substrates and ceramic assemblies.
Marble precision platform with gantry design ensures high-speed stability and vibration resistance.
Applications
Photovoltaic Industry
Solar cell ceramic parts, SiC functional components, ceramic suction cups.
Semiconductor Industry
Wafer carriers, precision device ceramics, semiconductor substrate components.
3C Electronics
Ceramic substrates, smartphone backplates and frames, wearable electronics ceramics.
New Energy
Hydrogen fuel cell ceramic components, automotive sensors, and high-precision energy devices.
Technical Specifications
Specification | Parameter |
Laser Wavelength | 1060–1080 nm |
Laser Power | 1000 W (customizable) |
Working Area | 600 × 600 mm |
Cutting Thickness | 0.2–10 mm (depending on material) |
Positioning Accuracy | ±5 μm |
Processing Speed | 0–3000 mm/min |
Max Travel Speed | 60 m/min |
Max Acceleration | 1.2 G |
Worktable Accuracy | ≤0.015 mm |
Drive System | Imported linear motor + 0.5 μm grating ruler |
Total Power | ≤7 KW |
Machine Weight | ≈1800 KG |
Dimensions (L×W×H) | 1800 × 1470 × 1890 mm |
Sample Applications
Drilling in Si₃N₄ ceramics
Si₃N₄ Drilling
SIC drilling hole
SIC tube drilling
why choose us
Self-developed Core Technology
11 laser processing patents + independently optimized control algorithms.
20% higher accuracy and efficiency than industry standards.
High-End Equipment Configuration
Nanosecond/picosecond pulses with minimal heat-affected zone. Ideal for thin and heat-sensitive materials-delivering precision processing for high-end applications.
Intelligent Operation
Auto-focus, visual positioning, and one operator-multi-machine support. Seamless integration with automated production lines for improved capacity and stability.
10+ Years of Industry Expertise
Core team with over a decade of experience in laser processing and equipment R&D. Tailored solutions for specialized processing needs.
YCLASER provides free sample testing and small-batch processing for global clients. Optimize your ceramic processing workflow with precision laser technology.
Our address
1st Floor, Building B, Phoenix Park, No.8, Optics Valley Science and Technology Park, No.18, Gaoxin 6th Road, Jiangxia District, Wuhan City
Phone Number
+8618602711568
FAQ
Q: Which file formats are supported? Does it support galvanometer & platform linkage?
A:Supports CAD/DXF import; galvanometer-platform linkage is standard, all process parameters adjustable via touch screen.
Q: What's your warranty policy and after-sales service?
A: 1-year standard machine warranty, extended laser warranty available. Free on-site installation & operator training domestically; overseas remote support plus optional field service. We provide lifelong online technical support for all customers.
Q: How about after-sales repair response?
A: Dedicated technical support with 24h domestic response; remote troubles hooting first, on-site service for complex faults.
Q: Can machine be customized with dual worktable or auto fixtures?
A: Customization available including worktable size, auto loading system and customized tooling as per production demands.
Q: What is standard lead time?
A: 20 working days for standard models, customized lead time confirmed upon project scheme.
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