Metallized Ceramic Laser Scribing Machine

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Metallized Ceramic Laser Scribing Machine
Details
✅ 355nm UV Cold Processing (No metal peeling)
✅ ≤20μm Kerf Width (High-density scribing)
✅ IGBT / 5G / Auto Ready (CCD Auto-Align)
Category
Alumina(Al2O3)Ceramic Laser Cutting Machine
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Description

Metallized ceramic substrates combine the excellent electrical insulation and thermal conductivity of ceramic materials with highly conductive metal layers. Typical substrates include thick-film ceramics, thin-film metallized ceramics, HTCC, LTCC, DBC, DPC, and AMB ceramic substrates.

 

The YCLASER Metallized Ceramic Laser Scribing Machine is designed specifically for precision scribing and dicing of metallized ceramic substrates. Equipped with a 355 nm UV nanosecond laser, intelligent laser energy control, CCD vision positioning, and a high-precision motion platform, it supports half-cut scribing, full-depth cutting, isolation groove machining, and automatic array dicing while minimizing thermal impact on both the ceramic substrate and metal coating.

Suitable for prototype development, small-batch production, and fully automated manufacturing.

 

Key Features

Designed for Metallized Ceramic Substrates

Optimized for ceramic substrates with silver, gold, nickel, copper, and active metal brazed coatings, providing stable processing quality for multilayer composite materials.

Protects Metal Coatings

The intelligent laser control system minimizes heat transfer, helping reduce coating peeling, oxidation, edge burning, and deformation while preserving coating adhesion and conductivity.

 

Excellent Edge Quality

The non-contact UV laser process helps minimize ceramic edge chipping, hidden micro-cracks, and backside damage, improving processing consistency for fragile ceramic substrates.

Ultra-Narrow Kerf

With a minimum kerf width of ≤20 μm, the machine increases material utilization and is ideal for high-density array layouts.

Multiple Processing Modes

Supports various laser processing applications, including:Half-cut laser scribing,Stealth laser scribing,Full-depth cutting,Isolation groove machining,Micro-hole drilling,Complex contour cutting

High-Speed Automated Production

CCD vision positioning, automatic MARK recognition, and intelligent nesting improve production efficiency while supporting automatic loading and unloading systems.

 

 

Technical Specifications

 

FeatureSpecification
Compatible SubstratesAlumina (Al₂O₃), Aluminum Nitride (AlN), HTCC, LTCC, DBC, DPC, AMB, Thick/Thin-film Ceramics
Metal CoatingsCopper (Cu), Silver (Ag), Gold (Au), Nickel (Ni), Active Metal Brazed Layers
Ceramic Thickness0.10 – 4.0 mm
Laser Source355 nm UV Nanosecond Laser (Standard 15W; Optional: 20W UV / UV Picosecond)
Minimum Kerf Width≤ 20 μm
Heat Affected Zone (HAZ)≤ 5 μm
Repeat Positioning Accuracy± 2 μm
Machining Accuracy≤ ± 15 μm
Max Scanning Speed7000 mm/s
Processing Area300 × 300 mm / 400 × 400 mm (Customizable)
Motion SystemHigh-precision Linear Motor + Vacuum Chuck
Vision SystemCCD Camera + Auto MARK Recognition
Supported File FormatsDXF

 

Metallized Ceramic Laser Scribing Machine Sample
Typical Applications

The machine is suitable for precision scribing and dicing of:

  • Thick-film Ceramic Circuits
  • Semiconductor Ceramic Packages
  • Optical Sensor Substrates
  • RF & Microwave Ceramic Circuits
  • DBC / DPC / AMB Substrates
  • HTCC & LTCC Ceramic Packages
  • Ceramic Chip Carriers
  • Automotive Electronic Ceramics

 

Optional Configurations

Dual Working Table

Doubles operational efficiency. Enables seamless, uninterrupted processing by alternating tables.

 Converyor Line Intergration

Connects Smoothly With Your Production Lines For Fully Automated Workflow And Material Transit.

Automatic Loading & Unloading

Maximizes hands-free operation to significantly boost throughput and reduce labor costs.

 

Why Choose the YCLASER Metallized Ceramic Laser Scribing Machine?

 

YCLASER specializes in precision laser processing solutions for advanced ceramic materials. Our metallized ceramic laser scribing machine is developed to improve machining quality for multilayer ceramic substrates while reducing coating damage, ceramic edge defects, and production costs.

With optimized UV laser technology, high-precision motion control, intelligent vision alignment, and customizable automation options, the machine provides a reliable solution for both prototype development and high-volume manufacturing.

Whether you require prototype development or automated mass production, YCLASER can provide complete laser processing solutions tailored to your manufacturing requirements.

 

 

Contact us today to request a free sample test or discuss your metallized ceramic processing application.

 

 

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