The Alumina DPC Substrate Laser Cutting Machine is specially designed for precision processing of DPC ceramic substrates. It supports laser drilling, laser cutting, and laser scribing, and is particularly suitable for singulating finished DPC substrates after circuit fabrication.
Using non-contact laser processing, the machine delivers stress-free machining with no edge chipping, making it ideal for prototype development, precision small-batch production, and cleanroom mass manufacturing.
Key Features
1.High-Performance Fiber Laser
The machine is equipped with an internationally advanced customized fiber laser featuring:
- Excellent beam quality
- Compact structure
- High electro-optical conversion efficiency
- Maintenance-free operation
- Low operating cost
- Low overall power consumption
2.High-Rigidity Precision Motion Platform
- Granite machine base
- Enclosed XY-axis separated structure
- Excellent rigidity and vibration resistance
- High-speed motion stability
The system adopts:
- Magnetic levitation linear motors
- 0.1 μm high-precision linear grating scale
- Fully closed-loop CNC control system
This combination provides fast response, high positioning accuracy, and low maintenance requirements.
Technical Specifications
| Item | Specification |
| Laser Wavelength | 1060–1080 nm |
| Laser Output Power | 150 W (Customizable) |
| Max. Cutting Area | 300 × 300 mm |
| Cutting Thickness | 0.2–2 mm (Depending on the material) |
| X/Y Repeat Positioning Accuracy | ±3 μm |
| Processing Speed | 0–2500 mm/min |
| Maximum Travel Speed | 60 m/min |
| Maximum Acceleration | 1.0 G |
| Worktable Precision | ≤0.015 mm |
| Transmission System | Imported Linear Motor + 0.1 μm Linear Grating Scale |
| Machine Power (Excluding Exhaust Fan) | ≤6 kW |
| Machine Weight | Approx. 1700 kg |
| Machine Dimensions (L × W × H) | 1400 × 1500 × 1800 mm |
Specifications are subject to the actual machine configuration.
Compatible Materials
- Alumina (Al₂O₃) DPC Ceramic Substrates
Aluminum Nitride (AlN) DPC Ceramic Substrates
Typical Applications
- LED Packaging – Precision cutting and singulation of DPC substrates for high-power LEDs
- Semiconductor Lasers – Ceramic substrate processing for VCSEL and related devices
- Power Module Packaging – Precision machining of ceramic circuit substrates
- Thick & Thin Film Circuits – Precision cutting of ceramic circuit boards
- Sensors – Ceramic components for MEMS sensors and pressure sensors
Recommended Laser Configuration
For laser cutting and drilling of Alumina DPC substrates, a 150 W QCW Fiber Laser is the preferred solution.
Combined with an absorptive coating process, it significantly improves laser absorption, resulting in higher processing quality and efficiency.
Service & Support
Free Sample Processing
Customers are welcome to send DPC substrates for free sample testing. Customized low-energy processing parameters are developed for ultra-fine circuits and thin substrates before production.
Long-Term Warranty
- Long-term machine warranty
- Lifetime process optimization
- Lifetime technical support
Installation & Training
Professional engineers provide on-site installation, commissioning, parameter optimization, circuit protection setup, and maintenance training.
24/7 Technical Support
Round-the-clock technical assistance for process optimization, equipment maintenance, and production troubleshooting.
Customized Production Solutions
Customized configurations are available according to circuit density, substrate size, production capacity, and automation requirements, including:
- Dual-workstation systems
- Automatic production lines
- Cleanroom-compatible configurations
Why Choose YCLASER ?
At WHYC Laser, we provide free sample processing and process evaluation to help customers identify the most suitable laser parameters before equipment investment or mass production. Upon request, our engineering team can also provide cutting quality reports and process recommendations to support reliable production planning.
Send us your drawings or samples and discover the optimal laser processing solution for your application.
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