YCLASERAluminum Nitride RF Substrate Laser Processing Machine is specially developed for precision machining of Aluminum Nitride (AlN) substrates used in high-frequency devices such as 5G, millimeter-wave, RF power amplifiers, and filters.
Machine Specifications
| No. | Item | Parameter |
| 1 | Laser Wavelength | 1060–1080 nm |
| 2 | Laser Output Power | 150W (Customizable) |
| 3 | Max. Cutting Range | 300 × 300 mm |
| 4 | Cutting Thickness | 0.2–2 mm (Depending on material) |
| 5 | Precision of Repeated Positioning of X/Y Axis | ±3 μm |
| 6 | Processing Speed | 0–2500 mm/min |
| 7 | Maximum Travel Speed | 60 m/min |
| 8 | Maximum Acceleration | 1.0G |
| 9 | Worktable Precision | ≤0.015 mm |
| 10 | Transmission Mode | Imported linear motor + 0.1 μm grating ruler |
| 11 | Whole Machine Power (No Fan) | ≤6 kW |
| 12 | Total Weight of the Whole Machine | Approx. 1700 kg |
| 13 | External Dimension (Length × Width × Height) | 1400 × 1500 × 1800 mm |
Flexible Laser Configuration Options
1. 150W QCW quasi-continuous fiber laser
2. 300W QCW quasi-continuous fiber laser
3. 30W 355nm nanosecond UV laser (Recommended primary solution for RF high-frequency substrates)
Optional Expansion Modules:
- Fully automatic loading and unloading system
- Full-field CCD vision automatic alignment system
Typical Applications
The equipment is suitable for processing various types of Aluminum Nitride substrates used in RF communication applications. Key applications include:
- 5G / millimeter-wave RF Aluminum Nitride circuit substrates
- Ceramic carriers for RF power amplifiers, isolators, and filters
- AlN substrates for microwave high-frequency device packaging
- Small and irregular ceramic substrates for RF semiconductor modules
- Aluminum Nitride heat dissipation substrates for high-frequency high-power RF devices
Integrated Processing Capabilities
A single machine can complete all precision processing procedures for RF substrates, supporting both prototype development and large-scale production:
- High-precision irregular contour cutting
- Micro array through-hole and blind-hole drilling
- Precise machining of RF impedance slots and isolation micro-slots
- Low-oxidation edge trimming with controlled surface oxide layer thickness
- Precise opening of metallized conductive areas
- Integrated forming of complex contours for miniaturized RF components
Equipment Features
1. High-rigidity integrated marble machine base, providing long-term continuous processing without thermal deformation and ensuring stable RF circuit dimensions.
2. Imported linear motor motion platform, delivering high-speed operation with low vibration to prevent ceramic edge chipping and dimensional deviation of ultra-thin substrates.
3. Full-axis closed-loop grating feedback motion control system, maintaining long-term positioning accuracy without drift.
4. Segmented high-purity high-pressure nitrogen-assisted gas system, rapidly removing molten residues and suppressing oxidation and blackening on cutting edges.
5. Industrial constant-temperature water cooling system, continuously controlling equipment temperature and reducing thermal stress-induced micro-cracks in Aluminum Nitride.
6. Built-in dedicated Aluminum Nitride RF processing database, matching high-frequency and low-loss machining standards.
7. Automated standardized processing workflow, with automatic power reduction buffering in micro-hole and narrow-slot areas to avoid defects caused by accumulated stress.
Why Choose WHYC RF Ceramic Laser Equipment
Professional precision laser equipment manufacturer with deep expertise in Aluminum Nitride substrate processing for communication and RF applications.
Dedicated process solutions developed for advanced ceramics including Aluminum Nitride, Alumina, Silicon Nitride, and Silicon Carbide.
Fully compatible with the strict acceptance standards of the RF industry, including oxidation-free processing, low loss, and zero micro-crack requirements..
One-stop delivery including customized machine hardware, RF process optimization, and on-site technical support.
Free Sample Testing Before Purchase
Contact us today and send your samples to our facility. We will evaluate cutting quality, edge conditions, and processing parameters, then recommend the most suitable laser processing solution.WHYC provides customized complete solutions for Aluminum Nitride RF substrate laser processing.
FAQ
Q: Can the machine drill Aluminum Nitride RF substrates?
A:Yes. The system supports multiple laser processes, including precision cutting, micro hole drilling, slot machining, and contour processing for AlN RF ceramic substrates.
Q: How does laser processing affect the performance of AlN RF substrates?
A:RF substrates require strict control of surface quality and dimensional accuracy. The machine uses optimized laser parameters and precision motion control to minimize cracks, chipping, and thermal damage, helping maintain substrate reliability after processing.
Q: What thickness of Aluminum Nitride RF substrates can be processed?
A:The processing capability depends on substrate thickness, size, and required edge quality. The machine can be customized for different AlN substrate specifications used in RF, microwave, and semiconductor applications.
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