Aluminum Nitride IGBT Substrate Laser Machine

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Aluminum Nitride IGBT Substrate Laser Machine
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The YCLASER Aluminum Nitride IGBT Substrate Laser Machine is specially developed for the precision laser processing of Aluminum Nitride (AlN) ceramic substrates used in IGBT power modules. The machine integrates laser drilling, slotting, contour cutting, and precision edge trimming into a single...
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Aluminum Nitride(AlN)Ceramic Laser Cutting Machine
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Description

The YCLASER Aluminum Nitride IGBT Substrate Laser Machine is specially developed for the precision laser processing of Aluminum Nitride (AlN) ceramic substrates used in IGBT power modules.

 

The machine integrates laser drilling, slotting, contour cutting, and precision edge trimming into a single platform, minimizing repositioning errors while providing stable machining performance for brittle ceramic materials.

 

Specifications

ItemSpecification
Laser Wavelength1060–1080 nm
Laser Power150–1000 W (Optional)
Processing Area≤300 × 400 mm
Processing Thickness0.2–10 mm (Depending on Material)
Repeat Positioning Accuracy±5 μm
Processing Speed0–2000 mm/min
Maximum Travel Speed50 m/min
Machining Accuracy±0.01–0.02 mm
Worktable Accuracy≤0.015 mm
Motion SystemImported Linear Motor + 0.5 μm Grating Scale
Machine Power≤5 kW
Machine WeightApprox. 1200 kg
Machine Dimensions1150 × 1500 × 1850 mm

Flexible Laser Configurations (Optional)

  • 150W–1KW QCW Fiber Laser
  • 355nm Nanosecond UV Laser
  • Automatic Loading & Unloading
  • CCD Vision Alignment
  • Dual Heads with Dual Optical Paths
ALN  IGBT Substrate Sample
Typical Applications

The machine is widely used for manufacturing:

  • Aluminum Nitride (AlN) IGBT Substrates
  • Silicon Carbide (SiC) Power Module Substrates
  • EV Inverter Ceramic Substrates
  • Power Semiconductor Packages
  • Ceramic Heat Sinks
  • High-Power Electronic Modules

Processing Capabilities

One machine supports multiple laser processing operations.

  • Precision Contour Cutting
  • Micro-Hole Drilling
  • Slot Cutting
  • Edge Trimming
  • Window Opening
  • Complex Profile Machining

Suitable for both prototype development and mass production.

 

Standard Machine Features

  • High-Rigidity Marble Machine Base
  • Precision Linear Motor Motion Platform
  • Closed-Loop Motion Control
  • Nitrogen Assist Gas System
  • Industrial Water Cooling
  • Dedicated Aluminum Nitride (AlN) Processing Database
  • Automated Processing Workflow

Why Choose WHYC Laser

 

 

 

Professional Manufacturer of Precision Laser Processing Equipment

 

Specialized in Advanced Ceramic Laser Processing

 

Customized Solutions for Aluminum Nitride (AlN), Alumina (Al₂O₃), Silicon Nitride (Si₃N₄), Silicon Carbide (SiC), and Zirconia (ZrO₂)

 

Integrated Equipment, Process Development, and Technical Support

 

Free Sample Testing Before Purchase

Our application engineers can evaluate your drawings or samples and recommend the most suitable laser configuration based on the following information:

  • Material Type
  • Substrate Thickness
  • Hole Diameter
  • Cutting Profile
  • Production Capacity
  • Precision Requirements
Contact us today for free sample testing and customized laser processing solutions.

 

FAQ

 

Q: What thickness of Aluminum Nitride substrates can be processed by this laser machine?

A:The machine can process AlN ceramic substrates with different thicknesses depending on the material grade, laser configuration, and application requirements. Typical applications include thin AlN substrates for IGBT and power module packaging, as well as thicker ceramic components requiring precision cutting.

Q: Which laser source is recommended for Aluminum Nitride IGBT substrate cutting?

A:For high-precision AlN substrate processing, UV nanosecond lasers are commonly recommended due to their smaller heat-affected zone and better edge quality. For thicker AlN ceramic parts requiring higher processing efficiency, QCW fiber laser solutions can also be considered.

Q: Does laser cutting Aluminum Nitride cause cracks or edge chipping?

A:AlN ceramics are hard and brittle materials, so improper laser parameters may cause micro cracks or edge defects. The machine uses optimized laser parameters, scanning strategies, and process control methods to minimize thermal stress and improve cutting stability.

Q: What accuracy can be achieved when cutting Aluminum Nitride substrates?

A:The machine adopts a high-precision motion platform and closed-loop positioning system to achieve micron-level processing accuracy. The actual accuracy depends on substrate size, thickness, laser parameters, and process requirements.

Q: Can you provide sample testing before purchasing an AlN laser cutting machine?

A:Yes. Customers can send their Aluminum Nitride substrate samples for laser processing evaluation. We can optimize the laser parameters and provide cutting results before equipment investment.

 

 

 

 

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