Silicon nitride (Si₃N₄) ceramic substrates are increasingly used in EV, IGBT, SiC power modules, and energy storage systems due to their excellent thermal shock resistance and mechanical strength.
Traditional manufacturing typically requires separate machines for drilling, scribing, and contour cutting, leading to repeated handling, multiple alignments, and higher production costs.
Our integrated laser processing platform completes these operations in a single setup, reducing handling, improving positional accuracy, and simplifying production.
One Platform, Multiple Processes
After one-time vacuum clamping and CCD alignment, the machine can automatically perform:
›››Laser drilling
›››Laser scribing
›››Contour cutting
Using one coordinate system throughout the process minimizes alignment errors and reduces the risk of chipping or hidden cracks caused by repeated handling.
Two Laser Options
150W QCW Fiber Laser
Ideal for:
›››Contour cutting
›››Panel separation
›››Grooving
›››Medium-thickness Si₃N₄ substrates (0.4–1.2 mm)
Advantages
›››No carbon coating required
›››High cutting efficiency
›››Optimized layered cutting to reduce thermal stress
355nm UV Nanosecond Laser
Ideal for:
›››Precision micro drilling
›››Fine scribing
›››Thin substrates (0.1–0.8 mm)
›››High-density ceramic packages
Advantages
›››Small heat-affected zone
›››Smooth hole walls
›››Better edge quality
›››Higher precision for micro features
Optional Automation
Automatic loading and unloading is available as an option.
Customers can choose manual loading for prototyping or add an automation module for high-volume, 24/7 production with:
›››Multi-layer magazines
›››Vacuum handling
›››Automatic collection
›››MES connectivity
Designed for Silicon Nitride
To reduce thermal stress during machining, the system includes:
›››Vacuum chuck
›››High-pressure nitrogen assist
›››Water-cooled worktable
›››Layer-by-layer machining strategy
These features help improve machining stability and reduce crack formation.
QCW Fiber vs. UV Laser
| Feature | QCW Fiber | 355nm UV |
| Contour Cutting | ★★★★★ | ★★★☆☆ |
| Micro Drilling | ★★☆☆☆ | ★★★★★ |
| Laser Scribing | ★★★★★ | ★★★★★ |
| Thin Substrates | ★★★☆☆ | ★★★★★ |
| Best For | High-speed cutting | High-precision machining |
Applications
The platform is suitable for:
›››Silicon Nitride (Si₃N₄)
›››Alumina (Al₂O₃)
›››Aluminum Nitride (AlN)
Typical applications include IGBT modules, SiC power devices, EV electronics, energy storage systems, industrial power modules, and RF ceramic packages.
Conclusion
With drilling, scribing, and cutting completed in a single setup, the integrated laser platform simplifies silicon nitride manufacturing while improving accuracy and reducing handling.
Available with either a 150W QCW fiber laser or a 355nm UV nanosecond laser, it provides a practical solution for both high-volume production and precision ceramic processing. (Free sample testing is available. Inquiries are welcome.)
