Alumina DBC Substrate Laser Cutting Machine

The Alumina DBC Substrate Laser Cutting Machine is specifically designed for precision processing of Al₂O₃ DBC copper-clad ceramic substrates. Equipped with a dual-material laser processing system and intelligent layered energy control technology, it effectively solves the machining challenges of copper-ceramic composite materials.

The machine integrates DBC substrate cutting, scribing, grooving, profile cutting, and micro-drilling into one processing solution. It delivers non-contact machining with no delamination, no copper oxidation or burn marks, and no ceramic edge chipping, making it ideal for prototype development, small-batch customization, and high-volume production of medium and high-end DBC substrates.

1.Layered Cutting Technology for DBC Composite Structures

A DBC substrate consists of an upper copper layer, a ceramic core, and a lower copper layer.

This machine supports an advanced layered cutting process by independently controlling laser parameters-including power, frequency, and cutting speed-for both the copper and ceramic layers.

The copper layer is primarily processed through laser ablation, while the ceramic layer is separated using controlled thermal fracture, ensuring precise cutting of the composite structure.

2.High-Rigidity Precision Motion Platform

The machine adopts a granite machine base combined with a high-precision linear motor drive system.

· X/Y positioning accuracy: ±2 μm

· Repeat positioning accuracy: ±3 μm

This ensures outstanding cutting accuracy for high-precision DBC substrate processing.

3.Laser Source Options

QCW Fiber Laser

For alumina DBC substrates, the recommended solution is a 1064 nm QCW fiber laser, offering:

· High copper removal efficiency

· Small laser spot

· Narrow kerf width

· Reduced thermal shock through optimized laser parameters

· Significantly fewer surface micro-cracks

4.Infrared Picosecond Laser (Optional)

For customers requiring premium processing quality, an infrared picosecond laser is available.

Its ultra-short pulse "cold processing" technology further improves:

· Bending strength

· Thermal shock resistance

· Edge quality

· Overall processing reliability

5.CCD Vision Positioning System

The high-precision CCD vision system automatically recognizes alignment marks on etched DBC substrates, ensuring that the cutting path is accurately aligned with existing circuit patterns.

Automatic loading and unloading systems are also available for fully automated production.

6.Coaxial Gas Protection

During laser processing, coaxial assist gas protects the workpiece surface.

Gas pressure can be adjusted for different processing layers, effectively reducing slag adhesion and improving cut edge cleanliness.

Specifications are subject to the actual machine configuration.

Typical Applications

• Precision singulation of DBC substrates for IGBT power modules
• Ceramic substrate processing for MOSFET module packaging
• Automotive-grade power electronic ceramic substrates
• DBC substrate machining for Thermoelectric Coolers (TEC)
• Efficient cutting of DBC substrates for LED packaging

 

Contact Us

• Over 20 years of experience in precision laser processing
• Professional laser solutions for ceramic and DBC substrates
• Customized process development based on different substrate specifications
• Free sample testing before equipment purchase
• Global installation, training, and technical support
• Reliable equipment for both prototype development and mass production

Whether you are producing IGBT modules, MOSFET packages, automotive power electronics, or new energy semiconductor devices, YCLASER can help improve production yield, reduce manufacturing costs, and achieve consistent high-quality processing.

we provide more than just equipment-we deliver complete DBC substrate laser processing solutions, including process development, equipment customization, free sample testing, installation, and long-term technical support.

If you are looking for a reliable DBC laser cutting machine for Al₂O₃ DBC substrates, contact our team today via WhatsApp or email to discuss your application or request a free sample test.