Wafer Laser Cutting & Drilling Machine
The YCTC Series is designed for precision wafer cutting, drilling, scribing, and modification. Featuring a fiber laser, marble precision platform, linear motor drive, 0.1 μm grating scale, and CCD vision positioning, it delivers stable and accurate processing for semiconductor and advanced ceramic substrates.
Key Highlights
1060–1080 nm
Fiber Laser
±3 μm
X/Y Repeatability
0.1 μm
Grating Scale
60 m/min
Max. Movement Speed
1.0 G
Max. Acceleration
400 × 400 mm
Max. Processing Area
Processing Applications
Wafer Cutting · Wafer Drilling · Laser Scribing · Wafer Modification
Materials
Monocrystalline Silicon · Polycrystalline Silicon · SiC · Ceramic Substrates · Metallized Ceramics
Technical Specifications
| Item | Specification |
| Laser Wavelength | 1060–1080 nm |
| Laser Power | 150 W, customizable |
| Max. Cutting Range | 400 × 400 mm |
| Cutting Thickness | 0.2–2 mm* |
| X/Y Repeat Positioning Accuracy | ±3 μm |
| Processing Speed | 0–3000 mm/min |
| Max. Movement Speed | 60 m/min |
| Max. Acceleration | 1.0 G |
| Worktable Precision | ≤0.005 mm |
| Transmission | Linear Motor + 0.1 μm Grating Scale |
| Machine Power | ≤6 kW |
| Machine Weight | Approx. 2000 kg |
| Machine Dimensions | 1500 × 1600 × 1800 mm |
Cutting thickness depends on material properties.
Specifications may be customized according to material and processing requirements. Final specifications are subject to the actual machine configuration.
Machine Configuration
Fiber Laser
High beam quality · Low maintenance · Low operating cost
Precision Motion System
Marble platform · Linear motor · Full closed-loop CNC
Vision System
CCD positioning for precision wafer and ceramic processing
Processing System
Cutting · Drilling · Scribing · Modification
Applications
| Industry | Applications |
| Semiconductor | Wafer cutting, drilling, scribing, and wafer modification |
| SiC / Semiconductor Materials | SiC wafer cutting and drilling |
| PCB / Ceramic Electronics | Ceramic circuit board cutting, drilling, and scribing |
| 3C Electronics | Ceramic substrates, ceramic phone back covers, middle frames, wearable devices |
| New Energy | Solar photovoltaic components, automotive sensors, hydrogen fuel cell ceramic components |
Typical Wafer Processing Samples
Wafer Cutting | Wafer Drilling | Wafer Modification | Wafer Laser Scribing
The system can be configured according to wafer material, thickness, geometry, processing pattern, and production requirements.
Sample Testing Available
Send us your wafer material, thickness, processing drawing, and requirements for laser sample testing and process evaluation.
FAQ
Q: What wafer materials can the YCTC Series process?
A: The machine is mainly designed for monocrystalline silicon, polycrystalline silicon, silicon carbide (SiC) and other wafer substrate materials. It can also process ceramic and metallized ceramic substrates with CCD vision positioning.
Q: What processing functions are available?
A: The YCTC Series supports wafer cutting, drilling, laser scribing, and wafer modification, depending on the material, thickness, and processing requirements.
Q: What wafer thickness can be processed?
A: The standard cutting thickness range is 0.2–2 mm, depending on the material and its processing characteristics. The actual capability can be confirmed through sample testing.
Q: Can you test our wafer before equipment purchase?
A: Yes. We provide laser sample testing and process evaluation. Send us your wafer material, thickness, processing drawing, and requirements, and our engineering team can evaluate the suitable laser configuration and processing parameters.
Hot Tags: wafer laser cutting & drilling machine, China wafer laser cutting & drilling machine manufacturers, suppliers, factory, other materials, PCD Laser Cutting Machine
